PIC10LF320 Datasheet, PDF (156/193 Pages) Microchip Technology – 6/8-Pin Flash-Based, 8-Bit Microcontrollers

PIC10(L)F320/322
24.0 ELECTRICAL SPECIFICATIONS
24.1 Absolute Maximum Ratings^(†)
Ambient temperature under bias ...................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin
PIC10F320/322 ......................................................................................................... -0.3V to +6.5V
PIC10LF320/322 ....................................................................................................... -0.3V to +4.0V
on MCLR pin ........................................................................................................................... -0.3V to +9.0V
on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V)
Maximum current
on VSS pin⁽¹⁾
-40°C  TA  +85°C .............................................................................................................. 250 mA
+85°C  TA  +125°C ............................................................................................................. 85 mA
on VDD pin⁽¹⁾
-40°C  TA  +85°C .............................................................................................................. 250 mA
+85°C  TA  +125°C ............................................................................................................. 85 mA
Sunk by any I/O pin .............................................................................................................................. 50 mA
Sourced by any I/O pin ......................................................................................................................... 50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA
Total power dissipation⁽²⁾ ...............................................................................................................................800 mW
Note 1:
2:
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Section 24.4 “Thermal
Considerations” to calculate device specifications.
Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
DS40001585D-page 156
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