EQCO850SC.3-HS Datasheet, PDF (15/24 Pages) Microchip Technology – Pb-Free and RoHS Compliant

EQCO850SC.3-HS/EQCO875SC.3-HS
16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Width
Units
Dimension Limits
N
e
A
A1
A3
E
MILLIMETERS
MIN
NOM
MAX
16
0.65 BSC
0.80
0.87
0.95
0.00
0.02
0.05
0.20 REF
4.00 BSC
Exposed Pad Width
Overall Length
Exposed Pad Length
Terminal Width
Terminal Length
E2
1.95
2.05
2.15
D
4.00 BSC
D2
1.95
2.05
2.15
b
0.25
0.30
0.35
L
0.45
0.55
0.65
Notes:
Terminal-to-Exposed-Pad
K
0.425 REF
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-259B Sheet 2 of 2
 2010-2015 Microchip Technology Inc.
DS60001313A-page 15