TC4423_13 Datasheet, PDF (14/20 Pages) Microchip Technology – 3A Dual High-Speed Power MOSFET Drivers

TC4423/TC4424/TC4425
16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
n
B
2
1
h
45 
c
A

A2


L
A1
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer Distance
h
Foot Length
L
Foot Angle

Lead Thickness
c
Lead Width
B
Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter
§ Significant Characteristic
MIN
.093
.088
.004
.394
.291
.398
.010
.016
0
.009
.014
0
0
INCHES*
NOM
16
.050
.099
.091
.008
.407
.295
.406
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.413
.029
.050
8
.013
.020
15
15
MILLIMETERS
MIN
NOM
16
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
10.10
10.30
0.25
0.50
0.41
0.84
0
4
0.23
0.28
0.36
0.42
0
12
0
12
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-102
MAX
2.64
2.39
0.30
10.67
7.59
10.49
0.74
1.27
8
0.33
0.51
15
15
DS21421E-page 14
 2002-2012 Microchip Technology Inc.