MRF89XAM8A Datasheet, PDF (14/34 Pages) Microchip Technology – 868 MHz Ultra-Low Power

MRF89XAM8A
2.2 Printed Circuit Board
The MRF89XAM8A module PCB is constructed with
high temperature FR4 material, 4 layers and 0.032
inches thick. These layers are shown in Figure 2-3
through Figure 2-8. The stack up of the PCB is shown
in Figure 2-9
FIGURE 2-3:
TOP SILK SCREEN
FIGURE 2-5:
LAYER 2 — GROUND
PLANE
FIGURE 2-4:
TOP COPPER
FIGURE 2-6:
LAYER 3 — POWER
PLANE
DS70651A-page 12
Preliminary
© 2010 Microchip Technology Inc.