TC4424AVOE Datasheet, PDF (12/22 Pages) Microchip Technology – 3A Dual High-Speed Power MOSFET Drivers

TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
N
NOTE 1 _{1 2}
TOP VIEW
φ
b
E
E1
EXPOSED
PAD
e
N
L
K
E2
21
D2
BOTTOM VIEW
NOTE 1
A
A1
A2
A3
NOTE 2
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
–
0.85
Molded Package Thickness
A2
–
0.65
Standoff
A1
0.00
0.01
Base Thickness
A3
0.20 REF
Overall Length
D
4.92 BSC
Molded Package Length
D1
4.67 BSC
Exposed Pad Length
D2
3.85
4.00
Overall Width
E
5.99 BSC
Molded Package Width
E1
5.74 BSC
Exposed Pad Width
E2
2.16
2.31
Contact Width
b
0.35
0.40
Contact Length
L
0.50
0.60
Contact-to-Exposed Pad
K
0.20
–
Notes:
Model Draft Angle Top
φ
–
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
–
12°
Microchip Technology Drawing C04-113B
DS21998B-page 12
© 2007 Microchip Technology Inc.