MRF24WN0MA Datasheet, PDF (10/36 Pages) Microchip Technology – 2.4 GHz IEEE 802.11b/g/n Wireless Module

MRF24WN0MA/MB
FIGURE 1-7:
MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT
Best
Okay
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No Copper
in these Areas
1.3 Soldering Recommendations
The MRF24WN0MA/MB wireless module was assem-
bled using the IPC/JEDEC J-STD-020 Standard lead-
free reflow profile. The MRF24WN0MA/MB module
can be soldered to the host PCB using standard leaded
and lead-free solder reflow profiles.
To avoid damaging the module, adhere to the following
recommendations:
• Solder reflow recommendations are provided in
the Microchip Application Note, AN233 "Solder
Reflow Recommendation" (DS00233)
• Do not exceed a peak temperature (T_P) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations from the vendor
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
DS50002410A-page 10
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 2015 Microchip Technology Inc.