MCP39F511 Datasheet, PDF (1/62 Pages) Microchip Technology – Power-Monitoring IC with Calculation and Energy Accumulation

MCP39F511
Power-Monitoring IC with Calculation and Energy Accumulation
Features
• Power Monitoring Accuracy Capable of 0.1%
Error Across 4000:1 Dynamic Range
• Built-In Calculations on Fast 16-Bit Processing
Core
- Active, Reactive, Apparent Power
- True RMS Current, RMS Voltage
- Line Frequency, Power Factor
• 64-bit Wide Import and Export Active Energy
Accumulation Registers
• 64-bit Four Quadrant Reactive Energy
Accumulation Registers
• Signed Active and Reactive Power Outputs
• Dedicated Zero Crossing Detection (ZCD) Pin
Output with Less than 200 µs Latency
• Dedicated PWM Output Pin with Programmable
Frequency and Duty Cycle
• Automatic Event Pin Control through Fast Voltage
Surge Detection Less than 5 ms Delay
• Two Wire Serial Protocol with Selectable Baud
Rate Up to 115.2 kbps using Universal
Asynchronous Receiver/Transmitter (UART)
• Four Independent Registers for Minimum and
Maximum Output Quantity Tracking
• Fast Calibration Routines and Simplified
Command Protocol
• 512 Bytes User-Accessible EEPROM through
Page Read/Write Commands
• Low-Drift Internal Voltage Reference, 10 ppm/°C
Typical
• 28-lead 5x5 QFN Package
• Extended Temperature Range -40°C to +125°C
Applications
• Power Monitoring for Home Automation
• Industrial Lighting Power Monitoring
• Real-Time Measurement of Input Power for
AC/DC Supplies
• Intelligent Power Distribution Units
Description
The MCP39F511 is a highly integrated, complete
single-phase power-monitoring IC designed for
real-time measurement of input power for
AC/DC power supplies, power distribution units,
consumer and industrial applications. It includes
dual-channel Delta-Sigma ADCs, a 16-bit calculation
engine, EEPROM and a flexible 2-wire interface. An
integrated low-drift voltage reference with 10 ppm/°C in
addition to 94.5 dB of SINAD performance on each
measurement channel allows for better than 0.1%
accurate designs across a 4000:1 dynamic range.
Package Types
MCP39F511
5x5 QFN*
28 27 26 25 24 23 22
EVENT1 1
21 A_GND
NC 2
20 AN_IN
NC 3
UART_RX 4
COMMON_{A 5}
19 V1+
EP
29
18 V1-
17 I1-
OSCI 6
16 I1+
OSCO ₇
15 EVENT2
8 9 10 11 12 13 14
*Includes Exposed Thermal Pad (EP);
see Table 3-1.
 2015 Microchip Technology Inc.
DS20005393B-page 1