MCP2003_13 Datasheet, PDF (1/34 Pages) Microchip Technology – LIN J2602 Transceiver

MCP2003/4/3A/4A
LIN J2602 Transceiver
Features
• The MCP2003/2003A and MCP2004/2004A are
compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1 and are
compliant to SAE J2602
• Support Baud Rates up to 20 Kbaud with
LIN-compatible output driver
• 43V load dump protected
• Very low EMI meets stringent OEM requirements
• Very high ESD immunity:
- >20kV on VBB (IEC 61000-4-2)
- >14kV on LBUS (IEC 61000-4-2)
• Very high immunity to RF disturbances meets
stringent OEM requirements
• Wide supply voltage, 6.0V-27.0V continuous
• Extended Temperature Range: -40 to +125°C
• Interface to PIC^® MCU EUSART and standard
USARTs
• LIN bus pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive
• Automatic thermal shutdown
• Low-power mode:
- Receiver monitoring bus and transmitter off,
(≅ 5 µA)
Description
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN bus specification
Revision 2.1 and SAE J2602. The device is short-
circuit and over-temperature protected by internal
circuitry. The device has been specifically designed to
operate in the automotive operating environment and
will survive all specified transient conditions while
meeting all of the stringent quiescent current
requirements.
MCP200X family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2003, LIN-compatible driver, with WAKE
pins, wake up on falling edge of LBUS
- MCP2003A, LIN-compatible driver, with
WAKE pins, wake up on rising edge of LBUS
- MCP2004, LIN-compatible driver, with
FAULT/TXE pins, wake up on falling edge of
LBUS
- MCP2004A, LIN-compatible driver, with
FAULT/TXE pins, wake up on rising edge of
LBUS
Package Types
MCP2003/
2003A
PDIP, SOIC
MCP2004/
2004A
PDIP, SOIC
RXD ₁
CS 2
WAKE 3
TXD 4
8 ^VREN
RXD ₁
7 VBB CS/WAKE ₂
6 LBUS _{FAULT/TXE 3}
5 VSS
TXD 4
8 ^VREN
7 VBB
6 LBUS
5 VSS
MCP2003/
2003A
4x4 DFN*
MCP2004/
2004A
4x4 DFN*
RXD 1
8 VREN
RXD 1
8 VREN
CS 2 _EP 7 VBB ^CS/WAKE 2 EP 7 ^VBB
WAKE 3
9
6 LBUS ^{FAULT/TXE 3}
9
6 LBUS
TXD 4
5 VSS
TXD 4
5 VSS
* Includes Exposed Thermal Pad (EP); see Table 1-1.
© 2010-2011 Microchip Technology Inc.
DS22230D-page 1