D2300 Datasheet, PDF (3/8 Pages) Agere Systems – 1.3 mm D2300-Type Laser Isolated DFB Laser Module

Data Sheet
February 2000
1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Laser Reverse Voltage
dc Forward Current
Operating Case Temperature Range
Storage Case Temperature Range*
Photodiode Reverse Voltage
Photodiode Forward Current
* Does not apply to shipping container.
Symbol
VRLMAX
IFLMAX
TC
Tstg
VRPDMAX
IFPDMAX
Min
Max
Unit
—
2
V
—
150
mA
– 40
80
°C
– 40
85
°C
—
10
V
—
1
mA
Handling Precautions
Mounting Instructions
Power Sequencing
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this turn-
on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both handling
and testing. Follow guidelines such as
JEDEC Publication No. 108-A (Dec.
1988).
Lucent employs a human-body model (HBM) for ESD-
susceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to define the model. A standard HBM
(resistance = 1.5 kΩ, capacitance = 100 pF) is widely
used and, therefore, can be used for comparison pur-
poses. The HBM ESD threshold presented here was
obtained using these circuit parameters:
Parameter
Human-body Model
Lucent Technologies Inc.
Value
Unit
>400
V
The minimum fiber bend radius is 1.18 in. (30 mm).
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flatness
must be better than 0.001 in. (25.4 µm). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw-hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
0.062 (1.58)
0.031 (0.79)
0.118
(3.00)
0.086
(2.18)
0.140
(3.56)
0.129 (3.28) R
0.041 (1.04)
1-532
Note: Dimensions are in inches and (millimeters).
Figure 2. Fillister Head Screw
3