D2300 Datasheet, PDF (2/8 Pages) Agere Systems – 1.3 mm D2300-Type Laser Isolated DFB Laser Module

1.3 µm D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Description
The D2300-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, distributed-
feedback (DFB) laser designed for 1.3 µm applications.
The laser is designed to be used in OC-12/STM-4 (622
Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long-
reach and extended-reach applications.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard.
Lucent Technologies Microelectronics Group optoelec-
tronic components are qualified to rigorous internal
standards that are consistent with Telcordia Technolo-
gies TR-NWT-000468. All design and manufacturing
operations are ISO * 9001 certified. The module is fully
qualified for central office applications.
* ISO is a registered trademark of The International Organization for
Standardization.
Pin Information
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25 °C for case temperatures from –40 °C to +80 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the aver-
age laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25 Ω
impedance. The laser module is equipped with a sin-
gle-mode fiber. The pigtail has an 8 µm core and
125 µm cladding with a 900 µm tight buffer coating.
Pin
Name
1
Thermistor
2
Thermistor
3
Laser dc Bias (cathode) (–)
4
Back-facet Monitor Anode (–)
5
Back-facet Monitor Cathode (+)
6
Thermoelectric Cooler (+)*
7
Thermoelectric Cooler (–)*
8
Case Ground
9
Case Ground
10
Case Ground
11
Laser Anode^† (+)
12
RF Laser Input Cathode (–)
13
Laser Anode^† (+)
14
Case Ground
* A positive current through the thermoelectric heat pump cools the
laser.
† Both leads should be grounded for optimum performance.
7
6
5
–
+
+
TEC
4
3
–
–
L1
160 nH
2
1
TH
10 kΩ
PACKAGE
GROUNDS
R1 ^ISOLATOR
20 Ω
+
–+
8
9
10 11
Top view.
12 13
14
1-567
Figure 1. Circuit Schematic
2
Lucent Technologies Inc.