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MIC5528 Datasheet, PDF (3/14 Pages) Micrel Semiconductor – High-Performance 500mA LDO
Micrel, Inc.
MIC5528
Absolute Maximum Ratings(5)
Supply Voltage (VIN) .......................................... –0.3V to 6V
Enable Voltage (VEN)......................................... –0.3V to VIN
Power Dissipation (PD) ........................... Internally Limited(7)
Lead Temperature (soldering, 10sec) ........................ 260°C
Junction Temperature (TJ) ........................ –40°C to +150°C
Storage Temperature (Ts) ......................... –65°C to +150°C
ESD Rating(8).................................................................. 3kV
Operating Ratings(6)
Supply Voltage (VIN) ......................................... 2.5V to 5.5V
Enable Voltage (VEN).............................................. 0V to VIN
Junction Temperature (TJ) ........................ –40°C to +125°C
Junction Thermal Resistance
1.2mm × 1.2mm Extra Thin DFN-6 (θJA) .........173°C/W
Electrical Characteristics(9)
VIN = VEN = VOUT + 1V; CIN = COUT = 2.2µF; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C to +85°C, unless noted.
Parameter
Condition
Min.
Typ.
Max.
Units
Output Voltage Accuracy
Line Regulation
Load Regulation(10)
Dropout Voltage(11)
Ground Pin Current(12)
Ground Pin Current in Shutdown
Ripple Rejection
Current Limit
Output Voltage Noise
Auto-Discharge NFET Resistance
Enable Input
Variation from nominal VOUT
Variation from nominal VOUT; –40°C to +85°C
VIN = VOUT +1V to 5.5V; IOUT = 100µA
IOUT = 100µA to 500mA
IOUT = 150mA
IOUT = 500mA
IOUT = 0mA
IOUT = 500mA
VEN = 0V
f = 100Hz, IOUT = 100mA
f = 1kHz, IOUT = 100mA
VOUT = 0V
f =10Hz to 100kHz
VEN = 0V; VIN = 3.6V ; IOUT = –3mA
–2.0
–3.0
525
±1
0.02
14
80
260
38
42
0.05
70
60
800
175
25
+2.0
+3.0
0.3
65
180
500
55
65
1
%
%/V
mV
mV
µA
µA
dB
dB
mA
µVRMS
Ω
Enable Pulldown Resistor
Enable Input Voltage
Logic Low
Logic High
4
MΩ
0.2
V
1.2
Enable Input Current
VEN = 0V
VEN = 5.5V
0.01
1
µA
1.4
2
Turn-On Time
IOUT = 150mA
50
125
µs
Notes:
5. Exceeding the absolute maximum rating can damage the device.
6. The device is not guaranteed to function outside its operating rating.
7. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power
dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
8. Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5kΩ in series with 100pF.
9. Specification for packaged product only.
10. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are
covered by the thermal regulation specification.
11. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V
differential. For outputs below 2.5V, dropout voltage is the input-to-output differential with the minimum input voltage 2.5V.
12. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin
current.
May 5, 2014
3
Revision 1.1