MLX90217 Datasheet, PDF (7/8 Pages) List of Unclassifed Manufacturers – Hall-Effect Cam Sensor

MLX90217
Hall-Effect Cam Sensor
Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and
moisture sensitivity level, as defined in this specification, according to following test methods:
s IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount De-
vices
(classification reflow profiles according to table 5-2)
s EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
s CECC00802
Standard Method For The Specification of Surface Mounting Components (SMDs) of
Assessed Quality
s EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
s EN60749-15
Resistance to soldering temperature for through-hole mounted devices
s MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions
(regarding peak temperature, temperature gradient, temperature profile etc) additional classifica-
tion and qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis re-
garding assurance of adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation
(Directive on the Restriction of the Use of Certain Hazardous substances, RoHS) and customer
requests, Melexis has installed a Roadmap to qualify their package families for lead free proc-
esses also.
Various lead free generic qualifications are running, current results on request.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
ESD Procautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor
products.
3901090217
Rev. 009
Page 7
Jun/04