MLX90616 Datasheet, PDF (3/36 Pages) Melexis Microelectronic Systems – Infra Red Thermometer in TO-39 for high temperature thermometer guns

MLX90616ESF-HCA
Infra Red Thermometer in TO-39
for high temperature thermometer guns
3 Table of Contents
1 Functional diagram ................................................................................................................................................................................ 1
2 General Description ............................................................................................................................................................................... 1
General description (continued) ................................................................................................................................................................ 2
3 Table of Contents .................................................................................................................................................................................. 3
4 Glossary of Terms ................................................................................................................................................................................. 4
5 Maximum ratings ................................................................................................................................................................................... 4
6 Pin definitions and descriptions.............................................................................................................................................................. 5
7 Electrical Specifications ......................................................................................................................................................................... 6
8 Detailed description ............................................................................................................................................................................... 8
8.1 Block diagram ................................................................................................................................................................................ 8
8.2 Signal processing principle ............................................................................................................................................................. 8
8.3 Block description ............................................................................................................................................................................ 8
8.3.1 Amplifier.................................................................................................................................................................................. 8
8.3.2 Supply regulator and POR ...................................................................................................................................................... 9
8.3.3 EEPROM ................................................................................................................................................................................ 9
8.3.4 On-chip filtering and settling time: ......................................................................................................................................... 12
8.3.5 RAM...................................................................................................................................................................................... 13
8.4 SMBus compatible 2-wire protocol ............................................................................................................................................... 13
8.4.1 Functional description ........................................................................................................................................................... 13
8.4.2 Differences with the standard SMBus specification (reference [1]) ........................................................................................ 14
8.4.3 Detailed description............................................................................................................................................................... 14
8.4.4 AC specification for SMBus ................................................................................................................................................... 16
8.4.5 Bit transfer ............................................................................................................................................................................ 17
8.4.6 Commands ........................................................................................................................................................................... 17
8.4.7 Sleep Mode........................................................................................................................................................................... 18
8.4.8 MLX90616 SMBus specific remarks...................................................................................................................................... 19
8.5 PWM ............................................................................................................................................................................................ 20
8.5.1 Single PWM format ............................................................................................................................................................... 21
8.5.2 Customizing the temperature range for PWM output ............................................................................................................. 22
8.6 Switching Between PWM and SMBus communication.................................................................................................................. 23
8.6.1 PWM is enabled.................................................................................................................................................................... 23
8.6.2 Request condition ................................................................................................................................................................. 23
8.6.3 PWM is disabled ................................................................................................................................................................... 23
8.7 Computation of ambient and object temperatures......................................................................................................................... 24
8.7.1 Ambient temperature Ta ....................................................................................................................................................... 24
8.7.2 Object temperature To .......................................................................................................................................................... 24
8.7.3 Calculation flow..................................................................................................................................................................... 24
8.8 Thermal relay ............................................................................................................................................................................... 25
9 Unique Features .................................................................................................................................................................................. 26
10 Performance Graphs ......................................................................................................................................................................... 26
10.1 Temperature accuracy of the MLX90616 .................................................................................................................................... 26
10.1.1 Ambient temperature accuracy............................................................................................................................................ 26
10.1.2 Object temperature accuracy, using the internal temperature calculation algorithm ............................................................. 26
10.1.3 Object temperature accuracy, with external calculation ....................................................................................................... 26
10.2 Sensitivity ................................................................................................................................................................................... 26
10.3 Noise.......................................................................................................................................................................................... 27
10.4 Sensing element size ................................................................................................................................................................. 27
10.5 Field Of View (FOV) without external optics................................................................................................................................ 27
10.6 Spectral Filter ............................................................................................................................................................................. 28
11 Applications Information..................................................................................................................................................................... 29
11.1 Use of the MLX90616 thermometer in SMBus configuration ....................................................................................................... 29
11.2 Use of multiple MLX90616s in SMBus configuration................................................................................................................... 29
11.3 PWM output operation................................................................................................................................................................ 30
11.4 Thermal alert / thermostat........................................................................................................................................................... 31
12 Application Comments ....................................................................................................................................................................... 31
13 Standard information regarding manufacturability of Melexis products with different soldering processes .......................................... 33
14 ESD Precautions ............................................................................................................................................................................... 33
15 FAQ................................................................................................................................................................................................... 33
16 Package Information.......................................................................................................................................................................... 35
16.1 Part marking............................................................................................................................................................................... 35
17 References ........................................................................................................................................................................................ 36
18 Disclaimer.......................................................................................................................................................................................... 36
3901090616
Rev 002
Page 3 of 36
Data Sheet
August 20, 2012