MLX90323 Datasheet, PDF (2/25 Pages) Melexis Microelectronic Systems – 4 – 20 mA Loop Sensor Interface with Signal Conditioning and EEPROM

MLX90323
4 – 20 mA Loop Sensor Interface
with Signal Conditioning and EEPROM
Table of Contents
1 Functional Diagram ..........................................................................................................................................1
2 General Description..........................................................................................................................................1
3 Glossary of Terms ............................................................................................................................................3
4 Absolute Maximum Ratings..............................................................................................................................4
5 Pin Definitions and Descriptions.......................................................................................................................5
6 General Electrical Specifications......................................................................................................................6
7 Detailed General Description ...........................................................................................................................8
7.1 Understanding 4-20mA current loop interface...........................................................................................8
7.2 Analog features..........................................................................................................................................8
7.3 Digital features ...........................................................................................................................................9
7.4 Parameters calculation ............................................................................................................................10
7.5 Communications ......................................................................................................................................11
8 Temperature compensation ...........................................................................................................................13
9 Calibration ......................................................................................................................................................15
9.1 Baseline Calibration.................................................................................................................................15
9.2 Temperature calibration...........................................................................................................................15
9.3 Calibration procedure ..............................................................................................................................16
10 EEPROM and RAM byte definitions.............................................................................................................17
11 Unique Features ...........................................................................................................................................22
12 Application Information.................................................................................................................................22
13 Standard information regarding manufacturability of Melexis products with different soldering processes 23
14 ESD Precautions ..........................................................................................................................................24
15 Package Information ....................................................................................................................................24
16 Disclaimer.....................................................................................................................................................24
3901090323
Rev 003
Page 2 of 25
Data Sheet
Feb/12