MLX90290 Datasheet, PDF (13/14 Pages) Melexis Microelectronic Systems – High Speed Programmed Linear Hall IC

MLX90290
High Speed Programmed Linear Hall IC
2.75 BSC
1.60 BSC
see note 2
1.00 MAX
0.88
+0.02
- 0.03
SEATING PLANE
0.075
+0.025
- 0.050
TOP VIEW
0.50 BSC
SIDE VIEW
12° REF.
TYP.
0.10 R.
MIN.
4°^+/-4
B’
0.10 R.
MIN.
SEATING PLANE
B
0.40^+/-0.10
see note 5
0.575 REF.
END VIEW
WITH PLATING
BASE METAL
~
0.35
+0.05
- 0.10
0.30
0.45
SECTION B-B’
see note 6
1.45^+/-0.12
Hall plate location
Notes:
1. All dimensions are in millimeters
2. Outermost plastic extreme width does not include mold flash or
protrusions. Mold flash and protrusions shall not exceed
0.15mm per side.
3. Outermost plastic extreme length does not include mold flash
or protrusions. Mold flash and protrusions shall not exceed
0.25mm per side.
4. The lead width dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.07mm total in excess
of the lead width dimension at maximum material condition.
5. Dimension is the length of terminal for soldering to a substrate.
6. Dimension on SECTION B-B’ applies to the flat section of the
lead between 0.08mm and 0.15mm from the lead tip.
7. Formed lead shall be planar with respect to one another with
0.076mm at seating plane.
Marking:
Top marking :
Pin 1
XXX - last three digits of the lot
Bottom marking:
Pin 1
Date code - WW - calender week
Date code - YY - calender year
0.275 TYP
Remarks:
1. All dimensions are in millimeters
TOP VIEW
Package line
END VIEW
3901090290
Rev 001
Page 13 of 14
Data Sheet
October 2014