MLX90290 Datasheet, PDF (12/14 Pages) Melexis Microelectronic Systems – High Speed Programmed Linear Hall IC

MLX90290
High Speed Programmed Linear Hall IC
17.1.1
Trim and form with 2.54mm distance between leads; only available on tape
Parameter
Nominal
(&
Tolerance)
Component
Height
H1
19mm
(±0.5)
Component
Position
P2
6.35mm
(±0.4)
Hole
Diameter
Do
4mm
(±0.2)
Hole
Position
W1
9mm
(-0.5;+0.75)
Hole
Pitch
Po
12.7mm
(±0.3)
Component
Pitch
P1
12.7mm
(±0.3)
Right-Left
Bending
ΔP
±0.4mm
Parameter
Nominal
(&
Tolerance)
Lead
Spacing
F1 & F2
2.54mm
(±0.25mm)
Front-Rear
Bending
ΔH
±.0.3deg
Tape
Width
W
18mm
(±0.5)
Adhesive
Tape Width
Wo
6mm
(±0.2)
Adhesive to
Carrier Tape
Gap
W2
0.5mm
(-0.5; +0.3)
Vertical
Lead
Length
Ho
Component
Height Top
H2
15.5mm (±0.5) 22.0mm (±0.8mm)
3901090290
Rev 001
Page 12 of 14
Data Sheet
October 2014