5962-38267 Datasheet, PDF (3/40 Pages) –

1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
W
M
N
6
7
Descriptive designator
GDIP1-T32 or CDIP2-T32
CQCC1-N44
See figure 1
CQCC1-N32
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1(enhanced rad tolerant)
See figure 1(enhanced rad tolerant)
Terminals
32
44
32
32
30
36
32
32
32
32
Package style
Dual in-line
Square chip carrier
Flat package
Rectangular chip carrier
Grid array
Grid array
Flat package
Flat package
Flat package
Flat package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . .
 Thermal resistance, junction-to-case ( JC):
Cases X, Y and U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cases T and W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
-0.5 V dc to +6.0 V dc 3/
-55(C to +125(C
-65(C to +150(C
+300(C
See MIL-STD-1835
21(C/W 4/
18(C/W 4/
3(C/W 4/
2(C/W 4/
1.5(C/W 4/
1.5(C/W 4/
1.0 watts
+175(C 5/
10,000 cycles/byte (minimum)
20 years minimum
1.4 Recommended operating conditions.
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High level input voltage range (VIH) . . . . . . . . . . . . . . . . . . . . . .
Low level input voltage range (VIL) . . . . . . . . . . . . . . . . . . . . . .
Case operating temperature range (TC) . . . . . . . . . . . . . . . . . .
4.5 V dc minimum to 5.5 V dc maximum
0.0 V dc
2.0 V dc to VCC + 1.0 V dc 6/
-0.1 V dc to 0.8 V dc
-55(C to +125(C
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . 100 percent
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltages referenced to VSS (VSS = ground), unless otherwise specified.
3/ Negative undershoots to a minimum of -1.0 V are allowed with a maximum of 20 ns pulse width.
4/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede
the value indicated herein.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
6/ For device types 16-19 only, VIH on RES shall be VCC - 0.5 V min. to VCC + 1.0 V max.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
G
5962-38267
SHEET
3
DSCC FORM 2234
APR 97