MAX16072 Datasheet, PDF (8/8 Pages) Maxim Integrated Products – μP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package

µP Supervisory Circuits in
4-Bump (1mm x 1mm) Chip-Scale Package
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
4 UCSP
R41C1-1
21-0242
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
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