MAX16904_13 Datasheet, PDF (7/15 Pages) Maxim Integrated Products – 2.1MHz, High-Voltage, 600mA Mini-Buck Converter

MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
Pin Configurations
TOP VIEW
BST 1
SUP 2
LX 3
PGND 4
OUTS 5
+
MAX16904
EP
10 EN
9 GND
8 BIAS
7 SYNC
6 PGOOD
TDFN
BST 1 ⁺
16 N.C.
SUP 2
15 EN
SUP 3
14 GND
LX 4
MAX16904
13 BIAS
LX 5
12 SYNC
PGND 6
11 PGOOD
PGND 7
OUTS 8
10 N.C.
EP _{9 N.C.}
TSSOP
Pin Description
PIN
TDFN-EP TSSOP-EP
1
1
2
2, 3
3
4, 5
4
6, 7
5
8
6
11
7
12
8
13
9
14
10
15
⎯
9, 10, 16
⎯
⎯
NAME
FUNCTION
BST
SUP
LX
PGND
OUTS
PGOOD
SYNC
BIAS
GND
EN
N.C.
EP
Bootstrap Capacitor for High-Side Driver (0.1μF)
Voltage Supply Input. Connect a 4.7μF ceramic capacitor from SUP to PGND. Place the
capacitor very close to the SUP pin. For the TSSOP-EP package, connect both SUP pins
together for proper operation.
Buck Switching Node. LX is high impedance when the device is off. For the TSSOP
package, connect both LX pins together for proper operation.
Power Ground. For the TSSOP-EP package, connect both PGND pins together for proper
operation.
Buck Regulator Voltage-Sense Input. Bypass OUTS to PGND with a 10μF or larger X7R
ceramic capacitor.
Open-Drain Power-Good Output.
Sync Input. SYNC allows the device to synchronize to other supplies. When connected to
GND or unconnected, SKIP mode is enabled under light loads. When connected to a
clock source or BIAS, forced PWM mode is enabled.
+5V Internal Logic Supply. Connect a 2.2μF ceramic capacitor from BIAS to GND.
Analog Ground
Enable Input. EN is high-voltage compatible. Drive EN HIGH for normal operation.
No Connection. Not internally connected.
Exposed Pad. Connect EP to PGND. Do not use EP as the only ground connection.
Maxim Integrated
7