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MAX16904_13 Datasheet, PDF (3/15 Pages) Maxim Integrated Products – 2.1MHz, High-Voltage, 600mA Mini-Buck Converter
MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
SUP, EN..................................................................-0.3V to +42V
BST to LX..................................................................-0.3V to +6V
LX..............................................................-0.3V to (VSUP + 0.3V)
BST .........................................................................-0.3V to +47V
OUTS ......................................................................-0.3V to +12V
SYNC, PGOOD, BIAS............................................-0.3V to +6.0V
PGND to GND .......................................................-0.3V to +0.3V
LX Continuous RMS Current .................................................1.0A
OUTS Short-Circuit Duration ......................................Continuous
ESD Protection
Human Body Model .........................................................±2kV
Machine Model ..............................................................±200V
Continuous Power Dissipation (TA = +70°C)
TDFN (derate 24.4 mW/°C above +70°C)......................1951mW
TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θJA) ...........41°C/W
Junction-to-Case Thermal Resistance (θJC) ..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) ........38.3°C/W
Junction-to-Case Thermal Resistance (θJC) ..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VSUP = +14V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage Range
VSUP
(Note 2)
t < 1s
3.5
28
V
42
Supply Current
ISUP
EN = low
EN = high, no load
EN = high, continuous, no switching
4
8
μA
25
35
1
mA
UV Lockout
Bias Voltage
Bias Current Limit
BUCK CONVERTER
VUVLO
VUVLO,HYS
VBIAS
IBIAS
Bias rising
Hysteresis
+5.5V  VSUP  +42V
2.8
3
3.2
V
0.4
5
V
10
mA
Voltage Accuracy
VOUT = 5V, fixed frequency
-2.0% 5 +2.5%
VOUT,5V
VOUT = 5V, SKIP mode
(Note 3)
VOUT = 3.3V, fixed frequency
6V  VSUP  18V,
ILOAD = 0 to 600mA,
TA = -40°C to
-2.0%
-2.0%
5 +4%
3.3 +2.5%
V
VOUT,3.3V VOUT = 3.3V, SKIP mode
(Note 3)
+125°C
-2.0% 3.3 +4%
Maxim Integrated
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