MAX14541E Datasheet, PDF (7/8 Pages) Maxim Integrated Products – 3-Channel, Low-Leakage ESD Protector

3-Channel, Low-Leakage ESD Protector
__________Layout Recommendations
Proper circuit-board layout is critical to suppress ESD-
induced line transients (see Figure 6). The MAX14541E
clamps to 100V; however, with improper layout, the
voltage spike at the device can be much higher. A lead
inductance of 10nH with a 45A current spike results in an
additional 450V spike on the protected line. It is essential
that the layout of the PCB follows these guidelines:
1) Minimize trace length between the connector or input
terminal, I/O_, and the protected signal line.
2) Use separate planes for power and ground to reduce
parasitic inductance and to reduce the impedance to
the power rails for shunted ESD current.
3) Ensure short low-inductance ESD transient return
paths to GND and VCC.
4) Minimize conductive power and ground loops.
5) Do not place critical signals near the edge of the
PCB.
6) Bypass VCC to GND with a low-ESR ceramic capaci-
tor as close as possible to VCC.
7) Bypass the supply of the protected device to GND
with a low-ESR ceramic capacitor as close as pos-
sible to the supply pin.
VCC
L1
PROTECTED LINE
NEGATIVE ESD
CURRENT
PULSE
PATH TO
GROUND
L2
D1
I/O_
D2
GND
L3
Figure 6. Layout Considerations
V_C
PROTECTED
CIRCUIT
___________________________________________________Typical Application Circuit
I/0 LINE
I/0_
V_CC
0.1µF
MAX14541E
I/0
PROTECTED
V_CC
CIRCUIT
0.1µF
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