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DS17285_1 Datasheet, PDF (6/31 Pages) Maxim Integrated Products – Real-Time Clocks
Real-Time Clocks
POWER-UP/POWER-DOWN CHARACTERISTICS
(TA = -40°C to +85°C) (Note 2)
PARAMETER
Recovery at Power-Up
VCC Fall Time, VPF(MAX) to
VPF(MIN)
SYMBOL
tREC (Note 9)
tF
CONDITIONS
VCC Fall Time, VPF(MAX) to
VPF(MIN)
tR
DATA RETENTION (DS17x87 ONLY)
(TA = +25°C)
PARAMETER
SYMBOL
Expected Data Retention
tDR
(Note 9)
CONDITIONS
MIN TYP MAX UNITS
20
150
ms
300
µs
0
µs
MIN TYP MAX UNITS
10
Years
CAPACITANCE
(TA = +25°C) (Note 10)
PARAMETER
Capacitance on All Input Pins
Except X1
Capacitance on IRQ, SQW, and
DQ0–DQ7 Pins
SYMBOL
CIN
(Note 10)
CIO
(Note 10)
CONDITIONS
MIN TYP MAX UNITS
12
pF
12
pF
AC TEST CONDITIONS
PARAMETER
Input Pulse Levels:
Output Load Including Scope and Jig:
Input and Output Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times:
CONDITIONS
0 to 3.0V
50pF + 1TTL Gate
Input/Output: VIL max and VIH min
5ns
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode can cause loss of
data.
Note 1: RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature
exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-
washing techniques is acceptable, provided that ultrasonic vibrations not used to prevent damage to the crystal.
Note 2: Limits at -40°C are guaranteed by design and not production tested.
Note 3: All voltages are referenced to ground.
Note 4: All outputs are open.
Note 5: Specified with CS = RD = WR = VCC, ALE, AD0–AD7 = 0.
Note 6: Applies to the AD0–AD7 pins, IRQ, and SQW when each is in a high-impedance state.
Note 7: Measured with a 32.768kHz crystal attached to X1 and X2.
Note 8: Measured with a 50pF capacitance load plus 1TTL gate.
Note 9: If the oscillator is disabled in software, or if the countdown chain is in reset, tREC is bypassed, and the part becomes
immediately accessible.
Note 10: Guaranteed by design. Not production tested.
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