MAX1523EUT Datasheet, PDF (4/8 Pages) Maxim Integrated Products – RELIABILITY REPORT FOR MAX1523EUT PLASTIC ENCAPSULATED DEVICES

V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl ( Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ= 1 =
1.83
(Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 80 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 13.57 x 10^-9
λ = 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec.# 06-5647) shows the static circuit used for this test. Maxim also performs 1000 hour life
test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located
on the Maxim website at http://www.maxim-ic.com .
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The PY54-1 die type has been found to have all pins able to withstand a transient pulse of ±1000V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.