MAX1523EUT Datasheet, PDF(3/8 Page) Maxim Integrated Products – RELIABILITY REPORT FOR MAX1523EUT PLASTIC ENCAPSULATED DEVICES

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MAX1523EUT Datasheet, PDF (3/8 Pages) Maxim Integrated Products – RELIABILITY REPORT FOR MAX1523EUT PLASTIC ENCAPSULATED DEVICES

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II. Manufacturing Information

A. Description/Function:

B. Process:

C. Number of Device Transistors:

D. Fabrication Location:

E. Assembly Location:

F. Date of Initial Production:

Simple SOT23 Boost Controllers

S8 - Standard 8 micron silicon gate CMOS

1302

California, USA

Malaysia, Philippines or Thailand

January, 2001

III. Packaging Information

A. Package Type:

6-Lead SOT

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Non-Conductive Epoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-2301-0076

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

B. Passivation:

C. Interconnect:

D. Backside Metallization:

E. Minimum Metal Width:

F. Minimum Metal Spacing:

G. Bondpad Dimensions:

H. Isolation Dielectric:

I. Die Separation Method:

41 X 57 mils

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

TiW/ AlCu/ TiWN

None

.8 microns (as drawn)

2.7 mil. Sq.

SiO2

Wafer Saw

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