MAX16903 Datasheet, PDF (3/13 Pages) Maxim Integrated Products – 2.1MHz, High-Voltage, 1A Mini-Buck Converter Thermal Shutdown Protection

2.1MHz, High-Voltage, 1A Mini-Buck Converter
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
SUP, EN..................................................................-0.3V to +42V
BST to LX..................................................................-0.3V to +6V
LX..............................................................-0.3V to (V_SUP + 0.3V)
BST .........................................................................-0.3V to +47V
OUTS ......................................................................-0.3V to +12V
SYNC, PGOOD, BIAS............................................-0.3V to +6.0V
PGND to GND .......................................................-0.3V to +0.3V
LX Continuous RMS Current .................................................1.5A
OUTS Short-Circuit Duration ......................................Continuous
ESD Protection
Human Body Model .........................................................±2kV
Machine Model ..............................................................±200V
Continuous Power Dissipation (T_A = +70°C)
TDFN (derate 24.4 mW/°C above +70°C)......................1951mW
TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ_JA) ...........41°C/W
Junction-to-Case Thermal Resistance (θ_JC) ..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ_JA) ........38.3°C/W
Junction-to-Case Thermal Resistance (θ_JC) ..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_SUP = +14V, T_A = T_J = -40°C to +125°C, unless otherwise noted. Typical values are at T_A = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage Range
V_SUP
(Note 2)
t < 1s
3.5
28
V
42
Supply Current
I_SUP
EN = low
EN = high, no load
EN = high, continuous, no switching
4
8
μA
25
35
1
mA
UV Lockout
Bias Voltage
Bias Current Limit
BUCK CONVERTER
V_UVLO Bias rising
V_UVLO,HYS Hysteresis
V_BIAS +5.5V
V_SUP
+42V
I_BIAS
2.8
3
3.2
V
0.4
5
V
10
mA
Voltage Accuracy
V_OUT,5V
V_OUT = 5V, fixed frequency
V_OUT = 5V, SKIP mode (Note 3)
6V
V_SUP
18V,
I_LOAD = 0 to 1A,
-2.0%
-2.0%
5
5
+2.5%
+4%
V_OUT,3.3V
V_OUT = 3.3V, fixed frequency
V_OUT = 3.3V, SKIP mode (Note 3)
T_A = 0°C to
+125°C
-2.0% 3.3 +2.5%
-2.0% 3.3 +4%
V
V_OUT,5V
V_OUT = 5V, fixed frequency
V_OUT = 5V, SKIP mode (Note 3)
6V
V_SUP
18V,
I_LOAD = 0 to 1A,
-3.0%
-3.0%
5
5
+2.5%
+4%
V_OUT,3.3V
V_OUT = 3.3V, fixed frequency
V_OUT = 3.3V, SKIP mode (Note 3)
T_A = -40°C to
+125°C
-3.0%
-3.0%
3.3 +2.5%
3.3 +4%
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