MAX1287EKA Datasheet, PDF (3/8 Pages) Maxim Integrated Products – PLASTIC ENCAPSULATED DEVICES

II. Manufacturing Information
A. Description/Function: 150ksps, 12-Bit, 2-Channel Single-Ended ADCs in SOT23
B. Process:
S6 (Standard 0.6 micron silicon gate CMOS)
C. Number of Device Transistors:
6922
D. Fabrication Location:
California, USA
E. Assembly Location:
F. Date of Initial Production:
Malaysia
October, 2001
III. Packaging Information
A. Package Type:
8-Pin SOT
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
N/A
E. Bondwire:
6 mil dia. ball
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-2101-0032
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
90 x 45 mils
Si₃N₄/SiO₂ (Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
0.6 microns (as drawn)
0.6 microns (as drawn)
5 mil. Sq.
SiO₂
Wafer Saw