MAX16929 Datasheet, PDF (23/25 Pages) Maxim Integrated Products – Automotive TFT-LCD Power Supply with Boost Converter and Gate Voltage Regulators

MAX16929
Automotive TFT-LCD Power Supply with Boost
Converter and Gate Voltage Regulators
Total Power Dissipation
The total power dissipated in the package is the sum of
the losses previously calculated. Therefore, total power
dissipation can be estimated as follows:
P_T = P_LXB + P_LXP + P_GH + P_GL + P_REG
Achieve maximum heat transfer by connecting the exposed
pad to a thermal landing pad and connecting the thermal
landing pad to a large ground plane through thermal vias.
Layout Considerations
Careful PCB layout is critical in achieving stable and
optimized performance. Follow the following guidelines
for good PCB layout:
1) Place decoupling capacitors as close as possible to
the device. Connect the power ground planes and the
analog ground plane together at one point close to the
device.
2) Connect input and output capacitors to the power
ground planes; connect all other capacitors to the
analog ground plane.
3) Keep the high-current paths as short and wide as
possible. Keep the path of switching currents short.
4) Place the feedback resistors as close to the IC as
possible. Connect the negative end of the resistive
divider and the compensation network to the analog
ground plane.
5) Route the high-speed switching node LXB and LXP
away from sensitive analog nodes (FB, FBP, FBGH,
FBGL, FBB, and REF).
Refer to the MAX16929 Evaluation Kit data sheet for a
recommended PCB layout.
Ordering Information/Selector Guide
PART
MAX16929AGUI/V+
MAX16929BGUI/V+
MAX16929CGUI/V+
MAX16929DGUI/V+
MAX16929EGUI/V+
MAX16929FGUI/V+
MAX16929GGUI/V+
MAX16929HGUI/V+
MAX16929IGUI/V+
REGULATOR
V_REG (V)
3.3
1.8
1.8
3.3
3.3
1.8
1.8
1.8
1.8
BUCK
V_OUTB (V)
5
5
3.3
5
5
5
5
3.3
3.3
BUCK
I_OUTB (A)
2
2
2
2
1.2
2
1.2
2
1.2
Note: All devices are specified over the -40°C to +105°C operating temperature range.
/V denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
BOOST
I_LIM (A)
1.5
1.5
1.5
0.75
0.75
0.75
0.75
0.75
0.75
PIN-PACKAGE
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
28 TSSOP-EP*
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
28 TSSOP-EP
PACKAGE
CODE
U28ME+1
OUTLINE
NO.
21-0108
LAND
PATTERN NO.
90-0147
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