MAX15112 Datasheet, PDF(21/23 Page) Maxim Integrated Products – High-Efficiency, 12A, Current-Mode Synchronous Step-Down Regulator with Integrated Switches

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MAX15112

High-Efficiency, 12A, Current-Mode Synchronous

Step-Down Regulator with Integrated Switches

Power Dissipation

The MAX15112 is available in a 24-bump WLP package

and can dissipate up to 2.15W at TA = +70NC. When

the die temperature exceeds +150NC, the thermal shutÂ

down protection is activated (see the Thermal Shutdown

Protection section).

Layout Procedure

Careful PCB layout is critical to achieve clean and stable

operation. It is highly recommended to duplicate the

MAX15112 Evaluation Kit layout for optimum perfor-

mance. The MAX15112 EV kit board has a small, quiet,

ground-shape SGND on the back side below the IC. This

ground is the return for the control circuitry, especially

the return of the compensation components. This SGND

is returned to the IC ground through vias close to the

ground bumps of the IC. If deviation is necessary, follow

these guidelines for good PCB layout:

1) Connect a single ground plane immediately adjacent

to the GND bumps of the IC.

2) Place capacitors on IN and SS/REFIN as close as

possible to the IC and the corresponding pad using

direct traces.

3) Keep the high-current paths as short and wide as

possible. Keep the path of switching current short

and minimize the loop area formed by LX, the output

capacitors, and the input capacitors.

4) An electrolytic capacitor is strongly recommended for

damping when there is significant distance between

the input power supply and the MAX15112.

5) Connect IN, LX, and GND separately to a large copÂper

area to help cool the IC to further improve efficiency.

6) Ensure all feedback connections are short and direct.

Place the feedback resistors and compensatÂion com-

ponents as close as possible to the IC.

7) Route high-speed switching nodes (such as LX and

BST) away from sensitive analog areas (such as FB

and COMP).

Ordering Information

PART

TEMP RANGE

PIN-PACKAGE

MAX15112EWG+

-40NC to +85NC

24 WLP

+Denotes a lead(Pb)-free/RoHS-compliant package.

PROCESS: BiCMOS

Chip Information

Package Information

For the latest package outline information and land patterns

(footprints), go to www.maxim-ic.com/packages. Note that a

â+â, â#â, or â-â in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PACKAGE PACKAGE

TYPE

CODE

OUTLINE

LAND

NO.

PATTERN NO.

24 WLP

(2.1mm x

3.05mm)

W242A3Z+1

21-0538

Refer to

Application

Note 1891

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