MAX16016_11 Datasheet, PDF (20/21 Pages) Maxim Integrated Products – Low-Power μP Supervisory Circuits with Battery-Backup Circuit and Chip-Enable Gating

Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
Selector Guide
PART
ALL LOGIC
OUTPUTS (EXCEPT MR
BATT_TEST)
MAX16016LTB_
Push-pull
√
MAX16016PTB_
Open-drain
√
MAX16020LTE_
Push-pull
√
MAX16020PTE_
Open-drain
√
MAX16021LTE_
Push-pull
√
MAX16021PTE_
Open-drain
√
POWER-FAIL
COMPARATOR
√
√
√
√
√
√
WATCHDOG
TIMER
BATTON
LOW-
LINE
OUTPUT
BATTOK/
BATT_TEST/
RESET
CHIP-
ENABLE
WDI
√
—
—
—
WDI
√
—
—
—
WDI/WDO
√
√
BATTOK/
BATT_TEST
√
WDI/WDO
√
√
BATTOK/
BATT_TEST
√
WDI/WDO
√
√
BATTOK/
√
RESET
WDI/WDO
√
√
BATTOK/
RESET
√
Ordering Information (continued)
PART
TEMP RANGE PIN-PACKAGE
MAX16020_TE_+T
MAX16021_TE_+T
-40°C to +85°C
-40°C to +85°C
16 TQFN-EP*
16 TQFN-EP*
The first placeholder “_” designates all output options. Letter
“L” indicates push-pull outputs and letter “P” indicates open-
drain outputs. The last placeholder “_” designates the reset
threshold (see Table 1).
T = Tape and reel.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
10 TDFN-EP
16 TQFN-EP
PACKAGE
CODE
T1033+1
T1644+4
OUTLINE
NO.
21-0137
21-0139
LAND
PATTERN NO.
90-0093
90-0070
20 ______________________________________________________________________________________