MAX16929_12 Datasheet, PDF (2/25 Pages) Maxim Integrated Products – Automotive TFT-LCD Power Supply with Boost Converter and Gate Voltage Regulators

MAX16929
Automotive TFT-LCD Power Supply with Boost
Converter and Gate Voltage Regulators
ABSOLUTE MAXIMUM RATINGS
INB, ENB to GND...................................................-0.3V to +42V
BST to GND...........................................................-0.3V to +47V
BST to LXB...............................................................-0.3V to +6V
LXB to GND..............................................................-6V to +42V
AVL, PGOOD to GND..............................................-0.3V to +6V
FBB to GND...........................................................-0.5V to +12V
CP, GH to GND......................................................-0.3V to +31V
CP, GH to GND (V_INA = 3.3V)...............................-0.3V to +29V
LXP to GND............................................................-0.3V to +20V
DRVN to GND........................................................-25V to +0.3V
INA, COMPV, FBP to GND......................................-0.3V to +6V
ENP, DR, FB, GATE, COMPI, FBGH,
FBGL, REF, SEQ to GND......................-0.3V to (V_INA + 0.3V)
GND to PGNDP.....................................................-0.3V to +0.3V
Continuous Power Dissipation (T_A = +70NC)
TSSOP (derate 27mW/NC above +70NC)...................2162mW
Operating Temperature Range......................... -40NC to +105NC
Junction Temperature Range........................... -40NC to +150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (B_JA)...........37NC/W
Junction-to-Case Thermal Resistance (B_JC)..................2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_INB = 12V, V_INA = 5V, V_GND = V_PGNDP = 0V, T_A = T_J = -40NC to +105NC, typical values are at T_A = +25NC, unless otherwise noted.)
(Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
BUCK CONVERTER
V_OUTB = 5V (Note 3)
5.5
Supply Voltage Range
V_INB
V_OUTB = 3.3V (Note 3)
4
t < 500ms
Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
I_INB
V_INB,UVLO
V_ENB = 0V
V_ENB = V_INB, no load, T_A = +25NC
AVL rising
PWM Switching Frequency
f_SWB
1.9
Spread-Spectrum Range
SSR
5V, continuous mode
-3%
Output-Voltage Accuracy
V_OUTB
6V P V_INB P 18V, ^{5V, skip mode}
-3%
I_LOAD < full load 3.3V, continuous mode -3%
3.3V, skip mode
-3%
High-Side DMOS R_{DS_ON}
R_{DS_ON(LXB)} I_LXB = 1A
Skip-Current Threshold
I_SKIP
Current-Limit Threshold
I_MAX
I_OUTB = 1.2A option
I_OUTB = 2.0A option
1.6
2.7
TYP
6
70
3.1
0.5
2.1
+6
5
5
3.3
3.3
180
16
2
3.4
MAX UNITS
28
28
V
42
9
FA
3.5
2.3
+3%
+6%
+3%
+6%
400
2.4
4.08
V
V
MHz
%
V
mI
%I_MAX
A
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