MAX16920 Datasheet, PDF (2/20 Pages) Maxim Integrated Products – Automotive Power-Management IC with Three Step-Down Converters and Linear Regulator

Automotive Power-Management IC with
Three Step-Down Converters and Linear Regulator
ABSOLUTE MAXIMUM RATINGS
OUT1, OUT2, FB1, FB2, FB3, POR, PG2,
PG3, PGA, OT to GND.........................................-0.3V to +6V
UVO, EN2, EN3, ENA, OUTA, SYNC, V_L to GND....-0.3V to +6V
UVI, UVS to GND...................................................-0.3V to +20V
UVI, UVS Input Current.................................................... ±10mA
OUT3 to GND.........................................................-0.3V to +10V
V_INA, V_INB, ODRV, LX1, LX2, LX3 to GND (500ms)..-0.3V to +45V
V_INA to V_INB..............................................................-2V to +18V
BST1, BST2, BST3 to PGND_ (500ms)..................-0.3V to +50V
Continuous Power Dissipation (T_A = +70°C)
TQFN (derate 37mW/°C above +70°C)......................2963mW
Operating Temperature Range......................... -40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (q_JA)...........27°C/W
Junction-to-Case Thermal Resistance (q_JC)..................1°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VINA = VINB = 14V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
V_INA/V_INB Operating Supply
Range
SYMBOL
V_IN
CONDITIONS
Full performance
DC-DC1 maintains regulation,
IOUT1 = 100mA (Note 2)
MIN
TYP MAX
5.5
18
4
28
VINA/VINB Supply Current in
Operation
I_IN
EN2 = EN3 = ENA = high, no
switching
2
3
V_INA/V_INB Supply Current,
Standby Mode
VL Undervoltage Lockout
V_L Undervoltage Lockout
Hysteresis
I_ST
Only DC-DC1 operating, EN2 = EN3
= ENA = low, I_OUT1 = no load
25
50
V_UVL V_L rising
2.9
3.15
3.4
V_UVH
0.4
V_L Output Voltage
UVI Threshold
VL
UVL
V_INA/V_INB falling
1.181
(-2%)
5
1.205
1.229
(+2%)
UVI Input Current
UVI Hysteresis
UVS Switch Resistance
Thermal Shutdown Temperature
I_UVI
UVH
R_UVS
T_S
VUVI = 1.2V
Temperature rising, OT output
asserted (Note 3)
10
1100
155
20
1540
170
1
30
2100
Thermal Shutdown Hysteresis
OVERVOLTAGE GATE DRIVER
T_H
(Note 3)
10
20
Overvoltage Shutdown Level
VOV
Input voltage rising, ODRV output
turns off external pMOSFET
18.7
19.2 19.7
Overvoltage Shutdown Level
V_OV,F Input voltage falling
18.1
UNITS
V
mA
FA
V
V
V
V
FA
mV
I
NC
NC
V
V
2