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MAX15090_13 Datasheet, PDF (2/15 Pages) Maxim Integrated Products – 2.7V to 18V, 12A, Hot-Swap Solution with Current Report Output
MAX15090/MAX15090A
2.7V to 18V, 12A, Hot-Swap Solution
with Current Report Output
Absolute Maximum Ratings
VCC to GND............................................................-0.3V to +20V
IN to GND...............................................................-0.3V to +20V
OUT to GND................................................-0.3V to (VIN + 0.3V)
GATE to OUT............................................................-0.3V to +6V
CDLY, ISENSE to GND............................-0.3V to (VREG + 0.3V)
EN, CB, UV, OV to GND..........................................-0.3V to +6V
REG to GND.............................-0.3V to min (+6V, (VCC + 0.3V))
PG, FAULT to GND................................................-0.3V to +20V
Continuous Power Dissipation (TA = +70NC)
WLP (derate 23.8mW/NC above +70NC).....................1500mW
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -60NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
Junction-to-Ambient Thermal Resistance (qJA)...............42°C/W
Junction-to-Case Thermal Resistance (qJC)......................7°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Thermal resistance can be lowered with improved board design.
Electrical Characteristics
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 33.2kω, and
TA = +25°C.) (Note 2)
PARAMETER
POWER SUPPLIES
VCC Operating Range
IN Operating Range
VCC Supply Current
IN Supply Current
VCC Default Undervoltage
Lockout
SYMBOL
CONDITIONS
VCC
VIN
ICC
IIN
VUVLO
VIN = 3V
RCB = 40.2kω, no load
RCB = 10kω, no load
VCC rising
MIN TYP MAX UNITS
2.7
18
V
2.7
18
V
0.5
0.75
mA
5.1
6.2
mA
1.4
1.8
2.35
2.5
2.65
V
VCC Default Undervoltage-
Lockout Hysteresis
VUVLO_HYS
0.1
V
REG Regulator Voltage
UV Turn-On Threshold
UV Turn-On Threshold
Hysteresis
OV Turn-On Threshold
OV Turn-On Threshold
Hysteresis
EN Threshold
EN Threshold Hysteresis
VREG
VUV_TH
VUV_HYS
VOV_TH
VOV_HYS
VEN_TH
VEN_HYS
No load, VCC > 4V
VUV rising
VUV falling
VOV rising
VOV falling
VEN rising
VEN falling
3.15 3.35 3.55
V
1.21 1.23 1.25
V
0.1
V
1.21 1.23 1.25
V
0.1
V
0.95
1
1.05
V
0.1
V
Maxim Integrated
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