MAX15068 Datasheet, PDF (2/17 Pages) Maxim Integrated Products – Dual ORing, Single Hot-Swap Controller

MAX15068
Dual ORing, Single Hot-Swap Controller with
Accurate Current Monitoring
Absolute Maximum Ratings
IN1, IN2 to GND........................................................-1V to +24V
PG, EN, FAULT, CSN to GND...............................-0.3V to +24V
CSP to GND..............................................-0.3V to (V_{IN_} + 0.6V)
V_S to GND................................................................-0.3V to +6V
ON, PC, IPMON, CB, CDLY to GND...........-0.3V to (V_S + 0.3V)
CSP to CSN..........................................................-0.3V to +0.3V
OUT to GND...........................................................-0.3V to +24V
GATE to GND.........................................................-0.3V to +36V
GATE to OUT.........................................................-0.3V to +20V
CP1 to GND...........................................................-0.3V to +36V
CP1 to IN1..............................................................-0.3V to +14V
CP2 to GND...........................................................-0.3V to +36V
CP2 to IN2..............................................................-0.3V to +14V
OG1..............................................(V_IN1 - 0.3V) to (V_CP1 + 0.3V)
OG2..............................................(V_IN2 - 0.3V) to (V_CP2 + 0.3V)
Current into EN, PG, FAULT...............................................20mA
Continuous Power Dissipation (T_A = +70°C)
20-TQFN (derate 30mW/ºC above +70°C)....................2400mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ_JA)........33.5°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V_IN1 = V_IN2 = 12V, C_IN1 = C_IN2 = C_VS = 1µF, T_A = -40°C to +125°C. Typical values are at T_A = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
SUPPLY VOLTAGE
Input Supply Voltage
SYMBOL
CONDITIONS
Hot swap and ORing
V_IN
Current monitor
MIN TYP MAX UNITS
3.7
18
V
4.8
18
Input Supply Current
Internal LDO Output Voltage
V_S Undervoltage Lockout
V_S Undervoltage-Lockout
Hysteresis
CSP Undervoltage Lockout
ORING
ORing MOSFET Forward
Regulation Voltage
(V_{IN_} - V_CSP)
ORing MOSFET Reverse Bias
Turn-Off Voltage
ORing MOSFET Reverse Bias
Turn-On Voltage
I_IN
V_S
V_UVLO
V_{UVLO_HYS}
V_{CSP_UVLO}
V_S rising
V_CSP rising
V_CSP falling
V_{FWD_REG}
V_{REV_OFF}
V_{REV_ON}
V_{IN_}- V_CSP, V_CSP rising
(V_CSP > V_{IN_}), V_{OG_} goes low
V_{IN_}- V_CSP, V_CSP falling
(V_{IN_} > V_{CSP_}), V_{OG_} goes to
forward regulation
4
mA
4.8
5
5.25
V
2.5
2.65
2.8
V
0.07
V
2.4
2.49 2.58
V
2.25 2.35 2.42
7.5
10
12.5
mV
-12.5 -10
-7.5
mV
+8.5 +10 +13.5 mV
ORing MOSFET Reverse Bias
Hysteresis Voltage
V_{REV_HYS} V_{REV_OFF} - V_{REV_ON}
20
mV
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