MAX15053_1107 Datasheet, PDF (2/21 Pages) Maxim Integrated Products – High-Efficiency, 2A, Current-Mode Synchronous, Step-Down Switching Regulator

High-Efficiency, 2A, Current-Mode
Synchronous, Step-Down Switching Regulator
ABSOLUTE MAXIMUM RATINGS
IN, PGOOD to GND.................................................-0.3V to +6V
LX to GND...................................................-0.3V to (VIN + 0.3V)
LX to GND........................................-1V to (VIN + 0.3V) for 50ns
EN, COMP, FB, SS/REFIN, SKIP to GND...-0.3V to (VIN + 0.3V)
LX Current (Note 1).................................................... -5A to +5A
Output Short-Circuit Duration....................................Continuous
Continuous Power Dissipation (TA = +70NC)
9-Bump WLP Multilayer Board
(derate 14.1mW/NC above TA = +70NC)....................1127mW
Operating Temperature Range........................... -40NC to +85NC
Operating Junction Temperature (Note 2)......................+105NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow).......................................+260NC
Note 1: LX has internal clamp diodes to GND and IN. Applications that forward bias these diodes should not exceed the IC’s pack-
age power dissipation limits.
Note 2: Limit the junction temperature to +105NC for continuous operation at maximum output current.
PACKAGE THERMAL CHARACTERISTICS (Note 3)
WLP
Junction-to-Case Thermal Resistance (BJC)....................26NC/W
Junction-to-Ambient Thermal Resistance (BJA)...............71NC/W
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VIN = 5V, TA = -40NC to +85NC, unless otherwise noted, typical values are at TA = +25NC.) (Note 4)
PARAMETER
IN Voltage Range
IN Shutdown Supply Current
IN Supply Current
VIN Undervoltage Lockout
Threshold
SYMBOL
VIN
IIN
CONDITIONS
VEN = 0V
VEN = 5V, VFB = 0.65V, no switching
LX starts switching, VIN rising
MIN TYP MAX UNITS
2.7
5.5
V
0.2
2
FA
1.56 2.3
mA
2.6
2.7
V
VIN Undervoltage Lockout
Hysteresis
LX stops switching, VIN falling
200
mV
ERROR AMPLIFIER
Transconductance
Voltage Gain
FB Set-Point Accuracy
FB Input Bias Current
COMP to Current-Sense
Transconductance
gMV
AVEA
VFB
IFB
gMC
Over line, load, and temperature
VFB = 0.6V
1.5
mS
90
dB
594 600 606
mV
-500
+500 nA
18
A/V
COMP Clamp Low
POWER SWITCHES
VFB = 0.65V, VSS = 0.6V
0.94
V
LX On-Resistance, High-Side
pMOS
30
mI
LX On-Resistance, Low-Side
nMOS
18
mI
High-Side Switch Current-Limit
Threshold
IHSCL
4
A
Low-Side Switch Sink Current-
Limit Threshold
4
A
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