MAX15026 Datasheet, PDF (2/23 Pages) Maxim Integrated Products – Low-Cost, Small, 4.5V to 28V Wide Operating Range, DC-DC Synchronous Buck Controller

Low-Cost, Small, 4.5V to 28V Wide Operating
Range, DC-DC Synchronous Buck Controller
ABSOLUTE MAXIMUM RATINGS
IN to GND ...............................................................-0.3V to +30V
BST to GND ............................................................-0.3V to +36V
LX to GND .................................................................-1V to +30V
EN to GND................................................................-0.3V to +6V
PGOOD to GND .....................................................-0.3V to +30V
BST to LX..................................................................-0.3V to +6V
DH to LX ...............................................….-0.3V to (V_BST + 0.3V)
DRV to GND .............................................................-0.3V to +6V
DL to GND ................................................-0.3V to (V_DRV + 0.3V)
V_CC to GND ...............-0.3V to the lower of +6V and (V_IN + 0.3V)
All Other Pins to GND.................................-0.3V to (V_CC + 0.3V)
V_CC Short Circuit to GND ...........................................Continuous
DRV Input Current.............................................................600mA
PGOOD Sink Current ............................................................5mA
Continuous Power Dissipation (T_A = +70°C) (Note 1)
14-Pin TDFN-EP, Multilayer Board
(derate 24.4mW/°C above +70°C) ..............................1951mW
Operating Temperature Range
MAX15026BETD+.............................................-40°C to +85°C
MAX15026BATD+...........................................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Dissipation wattage values are based on still air with no heatsink. Actual maximum power dissipation is a function of heat
extraction technique and may be substantially higher. Package thermal resistances were obtained using the method
described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal consid-
erations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V_IN = 12V, R_RT = 27kΩ, R_LIM = 30kΩ, C_VCC = 4.7µF, C_IN = 1µF, T_A = -40°C to +85°C (MAX15026BETD+), T_A = T_J = -40°C to
+125°C (MAX15026BATD+), unless otherwise noted. Typical values are at T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
GENERAL
Input Voltage Range
Quiescent Supply Current
Shutdown Supply Current
Enable to Output Delay
V_IN
I_{IN_SBY}
V_IN = V_CC = V_DRV
V_FB = 0.9V, no switching
EN = GND
4.5
28
V
4.5
5.5
1.75 2.75
mA
290 500
µA
480
µs
V_CC High to Output Delay
V_CC REGULATOR
Output Voltage
V_CC Regulator Dropout
V_CC Short-Circuit Output Current
V_CC Undervoltage Lockout
EN = V_CC
V_CC
V_{CC_UVLO}
6V < V_IN < 28V, I_LOAD = 25mA
V_IN = 12V, 1mA < I_LOAD < 70mA
V_IN = 4.5V, I_LOAD = 70mA
V_IN = 5V
V_CC rising
375
µs
5.0 5.25 5.5
V
0.28
V
100 200 300
mA
3.8
4.0
4.2
V
V_CC Undervoltage Lockout
Hysteresis
400
mV
ERROR AMPLIFIER (FB, COMP)
FB Input Voltage Set-Point
FB Input Bias Current
FB to COMP Transconductance
Amplifier Open-Loop Gain
V_FB
I_FB
V_FB = 0.6V
g_M
I_COMP = ±20µA
585 591 597
mV
-250
+250
nA
600 1200 1800
µS
80
dB
Amplifier Unity-Gain Bandwidth
Capacitor from COMP to GND = 50pF
4
MHz
V_COMP-RAMP Minimum Voltage
COMP Source/Sink Current
I_COMP V_COMP = 1.4V
160
mV
50
80
110
µA
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