MAX14890E Datasheet, PDF (2/30 Pages) Maxim Integrated Products – Overvoltage and Undervoltage Fault Detection

MAX14890E
Incremental Encoder Interface for RS-422,
HTL, and TTL with Digital Inputs
Absolute Maximum Ratings
(All voltages referenced to GND)
V_CC...........................................................................-0.3V to +6V
V_L .............................................................-0.3V to (VCC + 0.3V)
AO, BO, ZO, YO, LO, LO2, LO3..................-0.3V to (VL + 0.3V)
_FAULT, D2FAULT/IRQ............................................-0.3V to +6V
D3FAULT/ SDO (SPI is High).......................-0.3V to (VL + 0.3V)
D3FAULT/SDO (SPI is Low) ...................................-0.3V to +6V
TTL/SDI, SNGL/SCLK, HITH/CS, DI/TTLY,
DI/TTL2, DI/TTL3, SPI.........................................-0.3V to +6V
A, A, B, B, Z, Z, DIY, Y, DI2, DI3............................-40V to +40V
Short-Circuit Duration (_O, _FAULT, LO2,
D2FAULT/IRQ, LO3, D3FAULT/SDO to GND)......Continuous
Continuous Power Dissipation (T_A = +70°C)
Thin QFN (derate 19mW/°C above +70°C)................1520mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (Soldering, 10s).................................. +300°C
Soldering Temperature (Reflow).......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Junction-to-Ambient Thermal Resistance (θ_JA)...............36°C/W
Junction-to-Case Thermal Resistance (θ_JC)......................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_CC = 5V±10%, V_L = 1.62V to V_CC, T_A = -40°C to +125°C unless otherwise noted. Typical values are at V_CC = 5V, V_L = 3.3V,
T_A = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
POWER SUPPLY
Supply Voltage
V_CC
Supply Current
I_CC
Logic Supply Voltage
V_L
RS-422 RECEIVERS (RxA, RxB, RxZ, RxY)
Outputs not switching, no load
Differential Threshold Voltage
V_TH
-20V ≤ V_CM ≤ +20V
Differential Input Hysteresis
ΔV_TH -20V ≤ V_CM ≤ +20V
Single-Ended Input Current
I_IN
V_CC = 0V or 5V
V_IN = +10V
V_IN = -10V
Low Differential Voltage Fault
Threshold
V_{TH_DFP}
V_{TH_DFN}
-20V ≤ V_CM ≤ +20V, positive
-20V ≤ V_CM ≤ +20V, negative
Single-Ended Input Fault
V_{TH_SELP} Positive
Threshold
V_{TH_SELN} Negative
DIFFERENTIAL HTL RECEIVERS (RxA, RxB, RxZ)
Differential Threshold Voltage
Differential Input Hysteresis
Single-Ended Input Current
V_TH
ΔV_TH
I_IN
0V ≤ V_CM ≤ +25V
0V ≤ V_CM ≤ +25V
V_TH = +24V
V_TH = -10V
MIN TYP MAX UNITS
4.5
9
1.62
5.5
V
14
mA
5.5
V
-200
+200 mV
230
mV
+100 +160
μA
-270 -170
+270
-460
+460
mV
-270
+15
+18
V
-18
-15
-900
+900 mV
1
V
+280 +460
μA
-270 -170
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