MAX14842 Datasheet, PDF (2/13 Pages) Maxim Integrated Products – 6-Channel, Digital Ground-Level Translator

6-Channel, Digital Ground-Level Translator
ABSOLUTE MAXIMUM RATINGS
VDDA to GNDA.........................................................-0.3V to +6V
VDDB to GNDB.........................................................-0.3V to +6V
GNDB to GNDA......................................................-0.3V to +80V
INA1, INA2 to GNDA............................... -0.3V to (VDDA + 0.3V)
INB1, INB2 to GNDB............................... -0.3V to (VDDB + 0.3V)
OUTA1, OUTA2 to GNDA....................... -0.3V to (VDDA + 0.3V)
OUTB1, OUTB2 to GNDB....................... -0.3V to (VDDB + 0.3V)
I/OA1, I/OA2 to GNDA.............................................-0.3V to +6V
I/OB1, I/OB2 to GNDB.............................................-0.3V to +6V
Common-Mode Transients (i.e., Transients
Between GNDA and GNDB).......................................... 10V/Fs
Short-Circuit Duration (OUTA1, OUTA2 to GNDA;
OUTB1, OUTB2 to GNDB)......................................Continuous
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 25mW/NC above +70NC)......................2000mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Characteristics (qJA).....40°C/W
Junction-to-Case Thermal Characteristics (qJC)............6°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDDA - VGNDA = +3.0V to +5.5V, VDDB - VGNDB = +3.0V to +5.5V, VGNDB - VGNDA = 0 to +72V, TA = -40NC to +125NC, unless oth-
erwise noted. Typical values are at VDDA - VGNDA = +3.3V, VDDB - VGNDB = +3.3V, VGNDB - VGNDA = +50V, TA = +25NC.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Supply Voltage
SYMBOL
CONDITIONS
VDDA
VDDB
Relative to GNDA
Relative to GNDB
MIN TYP MAX UNIT
3.0
5.5
V
3.0
5.5
Supply Current
IDDA
IDDB
V_DDA - V_GNDA = +5.5V; V_DDB - V_GNDB =
+5.5V; VGNDB - VGNDA = +70V; all inputs
at VGNDA, VGNDB, or +5.5V; no load
7.5
mA
Voltage Between GNDB and
GNDA
VGG
VGNDB - VGNDA
0
72
V
Side B Leakage Current
Undervoltage-Lockout Threshold
Undervoltage-Lockout Hysteresis
LOGIC INPUTS AND OUTPUTS
Input Logic Threshold Voltage
IL
VUVLO
VUVLOHYS
VIT
VDDA - VGNDA, VDDB - VGNDB
VDDA - VGNDA, VDDB - VGNDB
I/OA1, I/OA2, relative to GNDA
INA1, INA2, relative to GNDA
1
mA
2
V
0.1
V
0.5
0.7 x
VDDA
0.7
V
Input Logic-High Voltage
INB1, INB2, relative to GNDB
VIH
0.7 x
VDDB
V
I/OA1, I/OA2, relative to GNDA
0.7
I/OB1, I/OB2, relative to GNDB
0.7 x
VDDB
2