MAX14782E_14 Datasheet, PDF (2/17 Pages) Maxim Integrated Products – 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection

MAX14782E
500Kbps 3.3V to 5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Absolute Maximum Ratings
(Voltages referenced to GND.)
V_CC ......................................................................-0.3V to +6.0V
RO............................................................. -0.3V to (V_CC + 0.3V)
RE, DE, DI.............................................................-0.3V to +6.0V
A, B (V_CC ≥ 3.6V) ..............................................-8.0V to +13.0V
A, B (V_CC < 3.6V) .............................................-9.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND..................Continuous
Operating Temperature Range
MAX14782EA_.............................................. -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Continuous Power Dissipation (T_A = +70°C)
SO (derate at 7.6mW/°C above +70°C).......................606mW
TDFN-EP (derate at 24.4mW/°C above +70°C).........1951mW
µMAX (derate at 4.8mW/°C above +70°C)..................387mW
Lead Temperature (soldering, 10s).................................. +300ºC
Soldering Temperature (reflow)....................................... +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Junction-to-Case Thermal Resistance (θ_JC)
SO................................................................................38°C/W
TDFN-EP........................................................................8°C/W
µMAX............................................................................42°C/W
Junction-to-Ambient Thermal Resistance (θ_JA)
SO..............................................................................132°C/W
TDFN-EP......................................................................41°C/W
µMAX..........................................................................206°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_CC = +3.0V to +5.5V, T_A = T_MIN to T_MAX, unless otherwise specified. Typical values are at V_CC = +5V and T_A = +25°C.) (Notes 2, 3)
PARAMETER
POWER SUPPLY
Supply Voltage
Supply Current
Shutdown Supply Current
DRIVER
Differential Driver Output
Change in Magnitude of Differential
Output Voltage
Driver Common-Mode Output
Voltage
Change in Magnitude of Common-
Mode Voltage
Single-Ended Driver Output High
Single-Ended Driver Output Low
Differential Output Capacitance
Driver Short-Circuit Output Current
SYMBOL
CONDITIONS
VCC
I_CC
I_SHDN
DE = V_CC, RE = GND, no load
DE = GND, RE = V_CC
VOD
ΔV_OD
V_CC = 4.5V, R_L = 54Ω, Figure 1
V_CC = 3V, R_L = 100Ω, Figure 1
V_CC = 3V, R_L = 54Ω, Figure 1
R_L = 54Ω or 100Ω, Figure 1 (Note 4)
VOC R_L = 54Ω or 100Ω, Figure 1
ΔV_OC
VOH
V_OL
COD
|I_OST|
R_L = 54Ω or 100Ω, Figure 1 (Note 4)
A or B output, I_{A or B} = -20mA
A or B output, I_{A or B} = 20mA
DE = RE = V_CC, f = 4MHz
0 ≤ V_OUT ≤ +12V, output low
-7V ≤ V_OUT ≤ V_CC, output high
MIN
TYP MAX UNITS
3.0
5.5
V
1.9
4
mA
10
µA
2.1
2.0
V
1.5
-0.2
0
+0.2
V
V_CC / 2 3
V
-0.2
+0.2
V
2.2
V
0.8
V
12
pF
250
mA
250
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