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MAX14778 Datasheet, PDF (2/15 Pages) Maxim Integrated Products – Dual 25V Above- and Below-the-Rails 4:1 Analog Multiplexer
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VDD..........................................................................-0.3V to +6V
VP............................ -0.3V to the lesser of +52V and (VN + 70V)
VN................. The lesser of (VDD - 40V) and (VP - 70V) to +0.3V
VP to VN.................................................................-0.3V to +70V
ENA, ENB, SA_, SB_................................. -0.3V to (VDD + 0.3V)
A_, ACOM, B_,
BCOM... (VN - 0.3V) to the lesser of (VP + 0.3V) and (VN + 52V)
Continuous Current Through Switch.............................. ±500mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 33.3mW/NC above +70NC)...............2666.7mW
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (BJA)...........30NC/W
Junction-to-Case Thermal Resistance (BJC)..................2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Supply Voltage Range
Supply Current
Charge-Pump Threshold
Analog Signal Range
Continuous Current
Through Switch
SYMBOL
VDD
IDD
VDDTH
VIN
ICOM
CONDITIONS
ENA = ENB = high
VENA = VENB = VDD/2
(Note 3)
VDD P VDDTH
VDD > VDDTH
VDD P VDDTH
VDD > VDDTH
Figure 1, switch open or closed
MIN
3.0
-25
-300
TYP
MAX UNITS
5.5
V
4.27
10
2.54
6
mA
4.31
10
2.59
6
4.64
V
+25
V
+300
mA
On-Resistance
RON
Figure 1, ICOM = Q300mA, VIN = Q25V
0.84
1.5
Ω
On-Resistance Flatness
RFLAT(ON)
Figure 1, -25V P VIN P +25V,
ICOM = Q300mA
3
mΩ
A_, B_ Off-Leakage
Current
IA(OFF),
IB(OFF)
Figure 2, VIN = 25V, VOUT = 0V
-200
+200
nA
ACOM, BCOM
Off-Leakage Current
IACOM(OFF),
IBCOM(OFF)
Figure 2, VOUT = 15V, VIN = 0V
-1
+1
FA
A_, B_ On-Leakage
Current
IA(ON),
IB(ON)
Figure 2, VIN = Q25V, ACOM or BCOM
is unconnected
-1
+1
FA
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