MAX14759 Datasheet, PDF (2/16 Pages) Maxim Integrated Products – Above- and Below-the-Rails Low On-Resistance Analog Switches

MAX14759/MAX14761/MAX14763
Above- and Below-the-Rails
Low On-Resistance Analog Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
V_CC...........................................................................-0.3V to +6V
EN, EN1, EN2, SEL................................ -0.3V to + (V_CC + 0.3V)
A, B, A1, A2, B1, B2, COM..................... (V_N - 0.3V) to Lesser of
(V_P + 0.3V) or (V_N + 52V)
V_P..................................................................... -0.3V to Lesser of
(+52V) or (V_N + 70V)
V_N.........................Greater of (V_CC - 40V) or (V_P - 70V) to +0.3V
V_P to V_N..................................................................-0.3V to +70V
Continuous Current Through Switch (MAX14759)......... Q500mA
Continuous Current Through Switch
(MAX14761, MAX14763)............................................ Q250mA
Continuous Power Dissipation (T_A = +70NC)
8-Pin TDFN Package
(derate 24.4mW/NC above +70NC)..........................1951.2mW
10-Pin TDFN Package
(derate 24.4mW/NC above +70NC)..........................1951.2mW
Operating Temperature Range........................... -40NC to +85NC
Storage Temperature Range............................. -65NC to +160NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
8-Pin TDFN
Junction-to-Ambient Thermal Resistance (q_JA)...........48°C/W
Junction-to-Case Thermal Resistance (q_JC)..................8°C/W
10-Pin TDFN
Junction-to-Ambient Thermal Resistance (q_JA)...........41°C/W
Junction-to-Case Thermal Resistance (q_JC)..................9°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_CC = +3.0V to +5.5V, T_A = -40°C to +85°C, unless otherwise noted. Typical values are at V_CC = 5V and T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
DC CHARACTERISTICS
Power Supply Range
Continuous Current Through
Switch
V_CC
(MAX14759)
I_{A_}
(MAX14761/MAX14763)
3.0
-500
-250
5.5
V
+500
mA
+250
Supply Current
Analog-Signal Range
On-Resistance
I_CC
V_COM,
V_{A_}, V_{B_}
R_ON
V_CC ≤ 4.7V
V_CC > 4.7V
V_{EN_} = V_CC
V_{EN_} = V_CC/2
V_{EN_} = V_CC
V_{EN_} = V_CC/2
Switch open or closed
I_B = Q500mA, V_A = Q25V (MAX14759)
I_COM or I_{B_} = Q250mA, V_{A_=} Q25V
(MAX14761/MAX14763)
4.1
10
4.1
10
mA
2.5
6
2.5
6
-25
+25
V
0.6
1
I
1.2
2
On-Resistance Flatness
DR_ON
-25V < V_A < +25V, I_B = Q500mA (MAX14759)
-25V < V_{A_} < +25V, I_{B_} or I_COM = Q250mA
(MAX14761/MAX14763)
2.4
mI
5.1
A, A1, A2 Off-Leakage Current
I_{A_(OFF)}
V_A = +25V, V_B = 0V, Figure 1 (MAX14759)
V_{A_} = +25V, V_COM or V_{B_}= 0V, Figure 1
(MAX14761/MAX14763)
-250
-250
+250
nA
+250
COM, B, B1, B2 Off-Leakage
Current
I_COM(OFF),
V_COM or V_B = 15V, V_{A_} = 0V, Figure 1
(MAX14759/MAX14763)
I_{B_(OFF) VB_ = 15V, VA_ = 0V, Figure 1 (MAX14761)}
-100
-100
+100
nA
+100
Maxim Integrated
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