MAX14670 Datasheet, PDF (2/13 Pages) Maxim Integrated Products – Bidirectional Current-Blocking, High-Input Overvoltage Protector with Adjustable OVLO

MAX14670–MAX14673
Bidirectional Current-Blocking, High-Input
Overvoltage Protector
with Adjustable OVLO
Absolute Maximum Ratings
(All voltages referenced to GND.)
IN (Note 1)..............................................................-0.3V to +29V
OUT........................................................................-0.3V to +26V
IN - OUT..................................................................-26V to +29V
OTG_EN, ACOK, ACOK..........................................-0.3V to +6V
OVLO.....................................................................-0.3V to +26V
Continuous Current into IN, OUT
WLP (Note 2)...................................................................±4.5A
TDFN............................................................................... ±3.2A
Continuous Power Dissipation (T_A = +70°C)
WLP (derate 16.4mW/°C above +70°C).....................1312mW
TDFN (derate 24.4mW/°C above +70°C)...................1951mW
Operating Temperature Range............................ -40°C to +85°C
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (reflow)........................................+260°C
Note 1: Survives burst pulses up to 80V with 2Ω series resistance and hot plug events. Above the input clamp voltage, the IN must
be a surge in nature with a limited energy.
Note 2: Limited by the PCB thermal design.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 3)
WLP
Junction-to-Ambient Thermal Resistance (θ_JA)...........52°C/W
TDFN
Junction-to-Ambient Thermal Resistance (θ_JA)...........41°C/W
Junction-to-Case Thermal Resistance (θ_JC)..................9°C/W
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_IN = +3V to +28V, V_OUT = +3V to +24V, T_A = -40°C to +85°C, unless otherwise noted. Typical values are at V_IN = +5V, T_A = +25°C.)
(Note 4)
PARAMETER
Input Startup Voltage
Input Sustaining Voltage
Input Clamp Voltage
Input Supply Current
Output Startup Voltage
Output Sustaining Voltage
Output Supply Current
Output Shutdown Current
IN Leakage Voltage
IN Discharge Current
SYMBOL
CONDITIONS
MIN
V_INBT
V_INBU I_OUT = 0A
V_{IN_CLAMP} I_IN = 10mA, T_A = +25°C
I_IN
V_OVLO = 0V, V_IN = 5V, ACOK is
unconnected, I_OUT = 0mA
V_OUTBT
V_OUTBU I_IN = 0A
I_OUT
V_OVLO = 0V, V_OUT = 5V, I_IN = 0mA,
V_{OTG_EN} = 1.8V
V_OVLO = 3V, V_OUT = 5V, V_IN = 0V,
V_{OTG_EN} = 0V
V_OUT = 21V, IN unconnected,
V_{OTG_EN} = 0V
V_IN = V_OUT = 5V, IN discharge current after
an OTG_EN transition from high to low
TYP MAX UNITS
2.17
3
V
1.5
2.3
V
33.7
V
100
190
µA
2.15
3
V
1.5
2.3
V
83
170
µA
6
12
µA
0.001 0.1
V
100
150
mA
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