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MAX14611 Datasheet, PDF (2/15 Pages) Maxim Integrated Products – Quad Bidirectional Low-Voltage Logic-Level Translator
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MAX14611
Quad Bidirectional Low-Voltage
Logic-Level Translator
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC...........................................................................-0.5V to +6V
VL...........................................................................-0.5V to +5.5V
TS.............................................................................-0.5V to +6V
I/OVCC_..................................................... -0.5V to (VCC + 0.5V)
I/OVL_........................................................... -0.5V to (VL + 0.5V)
Short-Circuit Duration I/OVL_, I/OVCC_ to GND........Continuous
Continuous Current.......................................................... Q50mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 24.4mW/NC above +70NC)................1951.2mW
TSSOP (derate 10mW/NC above +70NC) ..................796.8mW
Operating Temperature Range........................... -40NC to +85NC
Maximum Junction Temperature......................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN-EP
Junction-to-Ambient Thermal Resistance (qJA)............41°C/W
Junction-to-Case Thermal Resistance (qJC)...................8°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (qJA­).......100.4°C/W
Junction-to-Case Thermal Resistance (qJC).................30°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = 0.9V to the lesser of VCC + 0.3V and 5V. TA = TJ = -40NC to +85NC, unless otherwise noted. Typical
values are at VCC = +3.3V, VL = +1.8V, TA = +25NC, unless otherwise noted.) (Notes 2, 3)
PARAMETER
POWER SUPPLIES
VL Supply Range
SYMBOL
VL
CONDITIONS
MIN TYP MAX UNITS
0.9
5
V
VCC Supply Range
VCC
1.65
5.5
V
VL Supply Current
VCC Supply Current
VCC Shutdown Mode Supply
Current
VL Shutdown Mode Supply
Current
I/OVCC_, I/OVL_, TS Leakage
Current
TS Input Leakage Current
VL Shutdown Threshold
VCC Shutdown Threshold
I/OVL_ Pullup Resistor
I/OVCC_ Pullup Resistor
IVL
IVCC
ISHDN_VCC
ISHDN_VL
I/OVCC_ = VCC, I/OVL_ = VL, TS = VL
I/OVCC_ = VCC, I/OVL_ = VL, TS = VL
TS = GND, I/OVCC = unconnected
TS = VCC, VL = GND,
I/OVCC = unconnected
TS = GND
TS = VL, VCC = GND,
I/OVL_ = unconnected
ILEAK
TA = +25NC, TS = GND
ILEAK_TS
VTH_VL
VTH_VCC
RVL_PU
RVCC_PU
TA = +25NC
1
FA
35
FA
0.1
1
FA
0.1
1
0.1
1
FA
0.1
1
0.1
1
FA
1
FA
0.3 0.85
V
0.8 1.35
V
10
kI
10
kI
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