MAX14591_14 Datasheet, PDF (2/13 Pages) Maxim Integrated Products – High-Speed, Open-Drain Capable Logic-Level Translator

MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
ABSOLUTE MAXIMUM RATINGS
Voltages referenced to GND.
V_CC, V_L, TS..............................................................-0.5V to +6V
IOVCC1, IOVCC2.................................... -0.5V to +(V_CC + 0.5V)
IOVL1, IOVL2............................................. -0.5V to +(V_L + 0.5V)
Short-Circuit Duration IOVCC1, IOVCC2,
IOVL1, IOVL2 to GND............................................Continuous
V_CC, IOVCC_ Maximum Continuous Current at +110°C....100mA
V_L, IOVL_ Maximum Continuous Current at +110°C..........40mA
TS Maximum Continuous Current at +110°C......................70mA
Continuous Power Dissipation (T_A = +70NC)
TDFN (derate 6.2mW/NC above +70NC).......................496mW
WLP (derate 11.8mW/NC above +70NC)......................944mW
Operating Temperature Range........................... -40NC to +85NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (TDFN only, soldering, 10s)..............+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
WLP
Junction-to-Ambient Thermal Resistance (B_JA)............ 162NC/W
Junction-to-Case Thermal Resistance (B_JC).................. 20NC/W
Junction-to-Ambient Thermal Resistance (B_JA)............. 85NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_CC = +1.65V to +5.5V, V_L = +0.9V to min(V_CC + 0.3V, +3.6V), T_A = -40NC to +85NC, unless otherwise noted. Typical values are at
V_CC = +3V, V_L = +1.2V, and T_A = +25NC.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
POWER SUPPLY
Power Supply Range
V_L
0.9
V_CC
1.65
V_CC Supply Current
I_CC
IOVCC_ = V_CC, IOVL_ = V_L, TS = V_CC
V_L Supply Current
I_L
IOVCC_ = V_CC, IOVL_ = V_L, TS = V_CC
TS = GND
V_CC Shutdown Supply Current I_{CC-SHDN TS = VCC, VL = GND, IOVCC_ = unconnected}
V_L Shutdown Supply Current
I_L-SHDN
TS = GND
TS = V_L, V_CC = GND, IOVL_ = unconnected
IOVCC_, IOVL_ Three-State
Leakage Current
I_LEAK T_A = +25NC, TS = GND
TS Input Leakage Current
V_CC Shutdown Threshold
V_L Shutdown Threshold
V_L Above V_CC Shutdown
Threshold
I_{LEAK_TS}
V_{TH_VCC}
V_{TH_VL}
T_A = +25NC
TS = V_L, V_CC falling, V_L = 0.9V
TS = V_CC, V_L falling
V_{TH_VL-VCC} V_L rising above V_CC, V_CC = +1.65V
0.15
0.4
IOVL_ Pullup Resistor
R_{VL_PU} Inferred from V_OHL Measurements
3
IOVCC_ Pullup Resistor
R_{VCC_PU} Inferred from V_OHC Measurements
3
IOVL_ to IOVCC_ DC
Resistance
R_IOVL-IOVCC Inferred from V_OHx Measurements
TYP
23
0.5
1
1
0.1
0.1
0.1
0.8
0.3
0.73
7.6
7.6
6
MAX UNITS
5.5
V
5.5
47
FA
6
FA
2.2
FA
2.2
1
FA
1
1
FA
1
FA
1.35
V
0.8
V
1.1
V
12
kI
12
kI
17
I
Maxim Integrated
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