MAX13301 Datasheet, PDF (2/37 Pages) Maxim Integrated Products – 4-Channel, Automotive Class D Audio Amplifier Feedback After the Filter

4-Channel, Automotive Class D Audio Amplifier
ABSOLUTE MAXIMUM RATINGS
PVDD to PGND......................................................-0.3V to +30V
PVDD to PGND (t < 200ms)..................................-0.3V to +50V
PVDD Ramp Rate ........................................................... 25V/ms
VDD5, CM to PGND..................................................-0.3V to +6V
CP to PGND.........................(VPVDD - 0.3V) to (VCHOLD + 0.3V)
CHOLD to PVDD......................................................-0.3V to +6V
OUT_ to PGND, FB_ to PGND...............-0.3V to (VPVDD + 0.3V)
VDD to GND.............................................................-0.3V to +6V
REF to GND.............................................................-0.3V to +6V
SCL, SDA, SYNC to GND........................................-0.3V to +6V
MUTE_CL1, CL0, FLT_OT, EN to GND...................-0.3V to +6V
IN_ to GND...............................................................-0.3V to +6V
GND to PGND.......................................................-0.3V to +0.3V
Continuous Power Dissipation (Notes 1 and 2)
TSSOP (derate 16.7mW/NC above 70NC)...............1333.3mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature Range........................... -40NC to +150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+240NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Notes 1 and 2)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)...........60NC/W
Junction-to-Case Thermal Resistance (BJC)..................1NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 2: The 48-pin TSSOP-EPR package has a top side exposed pad for enhanced thermal management. Connect this exposed
pad to an external heatsink to ensure the device is adequately cooled. The maximum power dissipation in the device is a
function of this external heatsink and other system parameters. See the Thermal Information section for more information.
ELECTRICAL CHARACTERISTICS
(VPVDD = 14.4V, VDD = VDD5 = 5V, VGND = VPGND = 0V, fSW = 500kHz, MAP.COMP[2:0] = (see Table 20 for applicable setting),
TA = -40NC to +125NC; typical values are at TA = +25NC, unless otherwise noted.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP MAX UNITS
AMPLIFIER DC CHARACTERISTICS
Supply Voltage Range
VPVDD
VDD5
Operational
8
25.5
6
V
4.75
5
5.5
VDD
4.5
5
5.5
PVDD UVLO Threshold
Falling
5.2
5.35
5.6
V
PVDD OVLO Threshold
Rising
26
27
30
V
PVDD OVLO Response Timing
Rising
4
14
55
Fs
OUT_ and FB_ Voltage
OV active
VPVDD/2
V
VDD UV Threshold
Falling
Rising
4.2
4.35
V
4.5
4.6
VDD UV Threshold Hysteresis
0.1
0.2
V
VDD UV Threshold Deglitch
1
Fs
IPVDD
70
FA
Quiescent Supply Current
IVDD5
IVDD
RL = J, play mode (CTRL2 = 0x0F)
60
72
mA
50
75
2