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| MAX12528 Datasheet, PDF (2/28 Pages) Maxim Integrated Products – Dual, 80Msps, 12-Bit, IF/Baseband ADC | |||
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Dual, 80Msps, 12-Bit, IF/Baseband ADC
ABSOLUTE MAXIMUM RATINGS
VDD to GND ................................................................-0.3V to +3.6V
OVDD to GND............-0.3V to the lower of (VDD + 0.3V) and +3.6V
INAP, INAN to GND ...-0.3V to the lower of (VDD + 0.3V) and +3.6V
INBP, INBN to GND ...-0.3V to the lower of (VDD + 0.3V) and +3.6V
CLKP, CLKN to
GND ........................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFIN, REFOUT
to GND ..................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFAP, REFAN,
COMA to GND ......-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFBP, REFBN,
COMB to GND ......-0.3V to the lower of (VDD + 0.3V) and +3.6V
DIFFCLK/SECLK, G/T, PD, SHREF, DIV2,
DIV4 to GND .........-0.3V to the lower of (VDD + 0.3V) and +3.6V
D0AâD11A, D0BâD11B, DAV,
DORA, DORB to GND..............................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
68-Pin Thin QFN 10mm x 10mm x 0.8mm
(derate 70mW/°C above +70°C) ....................................4000mW
Thermal Resistance θjc........................................................0.4°C/W
Operating Temperature Range................................-40°C to +85°C
Junction Temperature ...........................................................+150°C
Storage Temperature Range .................................-65°C to +150°C
Lead Temperature (soldering, 10s)......................................+300°C
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, OVDD = 2.0V, GND = 0, REFIN = REFOUT (internal reference), CL â 10pF at digital outputs, AIN = -0.5dBFS (differen-
tial), DIFFCLK/SECLK = OVDD, PD = GND, SHREF = GND, DIV2 = GND, DIV4 = GND, G/T = GND, fCLK = 80MHz, TA = -40°C to
+85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
DC ACCURACY
Resolution
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Offset Error
Gain Error
ANALOG INPUT (INAP, INAN, INBP, INBN)
Differential Input Voltage Range
VDIFF
Common-Mode Input Voltage
Analog Input Resistance
RIN
Analog Input Capacitance
CPAR
CSAMPLE
CONDITIONS
fIN = 3MHz
fIN = 3MHz, no missing codes
Differential or single-ended inputs
Each input (Figure 3)
Fixed capacitance to ground,
each input (Figure 3)
Switched capacitance,
each input (Figure 3)
MIN TYP MAX UNITS
12
Bits
±0.6 ±1.6 LSB
±0.3 ±0.85 LSB
±0.1 ±0.7 %FSR
±0.5 ±4.3 %FSR
±1.024
V
VDD / 2
V
2
kâ¦
2
pF
4.5
CONVERSION RATE
Maximum Clock Frequency
Minimum Clock Frequency
fCLK
80
MHz
5
MHz
Data Latency
Figure 5
8
Clock
Cycles
DYNAMIC CHARACTERISTICS
Small-Signal Noise Floor
Signal-to-Noise Ratio
SSNF
SNR
Input at -35dBFS
fIN = 3MHz at -0.5dBFS
fIN = 40MHz at -0.5dBFS
fIN = 70MHz at -0.5dBFS
fIN = 175MHz at -0.5dBFS
71.0 72.1
69.3 71.2
70.7
70.7
67.1 69.8
dBFS
dB
2 _______________________________________________________________________________________
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