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DS1343_1112 Datasheet, PDF (19/20 Pages) Maxim Integrated Products – Low-Current SPI/3-Wire RTCs
Low-Current SPI/3-Wire RTCs
PART
TEMP RANGE
DS1343E-18+*
DS1343E-3+*
DS1343E-33+
DS1343D-18+*
DS1343D-3+*
DS1343D-33+
DS1344E-18+*
DS1344E-3+*
DS1344E-33+
DS1344D-18+*
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
DS1344D-3+*
DS1344D-33+
-40NC to +85NC
-40NC to +85NC
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Future product—Contact factory for availability.
**EP = Exposed pad.
TYP OPERATING
VOLTAGE (V)
1.8
3.0
3.3
1.8
3.0
3.3
1.8
3.0
3.3
1.8
3.0
3.3
Ordering Information
OSC CL
(pF)
6
6
6
6
6
6
12.5
12.5
12.5
12.5
12.5
12.5
PIN-PACKAGE
20 TSSOP
20 TSSOP
20 TSSOP
14 TDFN-EP**
14 TDFN-EP**
14 TDFN-EP**
20 TSSOP
20 TSSOP
20 TSSOP
14 TDFN-EP**
14 TDFN-EP**
14 TDFN-EP**
Chip Information
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
20 TSSOP
14 TDFN-EP
PACKAGE
CODE
U20+1
T1433+2
OUTLINE
NO.
21-0066
21-0137
LAND
PATTERN NO.
90-0116
90-0063
19