DS1646-120 Datasheet, PDF (11/13 Pages) Maxim Integrated Products – Nonvolatile Timekeeping RAM

DS1646/DS1646P
NOTES:
1) All voltages are referenced to ground.
2) Typical values are at 25°C and nominal supplies.
3) Outputs are open.
4) Data retention time is at 25°C and is calculated from the date code on the device package. The date
code XXYY is the year followed by the week of the year in which the device was manufactured. For
example, 9225 would mean the 25th week of 1992.
5) t_AH1, t_DH1 are measured from WE going high.
6) t_AH2, t_DH2 are measured from CE going high.
7) Real-Time Clock Modules (EDIP) can be successfully processed through conventional wave-
soldering techniques as long as temperatures as long as temperature exposure to the lithium energy
source contained within does not exceed +85°C. Post-solder cleaning with water washing techniques
is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND
PATTERN NO.
32 EDIP
MDF32+1
21-0245
—
34 PCAP
PC2+6
21-0246
—
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