TL21W02D1 Datasheet, PDF (7/14 Pages) Marktech Corporate – LED Lamps InGaN and Phosphor

TL21W02-D1(T34
9. Packing
9.1. Moisture-Proof Packing
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air
before soldering and the device should therefore be stored under the following conditions:
• This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5 to 30
Humidity: 90% (max)
• After opening the moisture proof bag, the device should be assembled within 168 hours in an environment
of 5 to 30/60% RH or below.
• If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
• Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
• If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
10. Mounting
10.1. Mounting Precautions
• Do not apply mechanical stress to the resin body at high temperature.
The time taken for a device to return to the room temperature after reflow soldering depends on the
mounting board and environmental conditions.
• The resin body is easily scratched. Avoid friction against hard materials.
• When installing an assembled board into equipment, ensure that the devices on the board do not contact
with other components.
7
2011-10-20
Rev.1.0