TLBD1050 Datasheet, PDF (6/11 Pages) Marktech Corporate – TOSHIBA LED Lamp

TLBD1050(T20),TLEGD1050(T20)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also,
be sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
240°C max
10 s max ^(*)
140~160°C max(*)
(*)
4°C/s max
4°C/s max^(*)
60~120 s max(*)
5 s max^(*)
(*)
260°C max
4°C/s max^(*)
max(*)
150~180°C 230°C
4°C/s max^(*)
60~120 smax^(*)
30~50s max(*)
Time (s)
Time (s)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Perform the first reflow soldering in accordance with the above temperature profile and within 72 hours of
opening the package.
• Second time reflow
In case of second reflow soldering should be performed within 72 hours of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 5 30°C, 70% RH max
• Do not perform flow soldering.
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: Less than 25 W
Temperature : Less than 350°C or less
Time
: within 3 s (Up to 1time per place)
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2007-5-17