EZ1000 Datasheet, PDF (2/5 Pages) Marktech Corporate – Gen II LEDs

Maximum Ratings at T_A = 25°C ^{Note 1, 2 & 3}
DC Forward Current
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
CxxxEZ1000-Sxx000-2
1000 mA
1250 mA
150°C
5V
-40°C to +100°C
-40°C to +125°C
Typical Electrical/Optical Characteristics at T_A = 25°C, If = 350 mA ^{Note 2}
Part Number
Forward Voltage (V_f, V)
C450EZ1000-Sxx000-2
C460EZ1000-Sxx000-2
C527EZ1000-Sxx000-2
Min.
2.9
2.9
3.0
Typ.
3.2
3.2
3.4
Max.
3.8
3.8
4.0
Reverse Current
[I(Vr=5V), μA]
Max.
2
2
2
Full Width Half Max
(λ_D, nm)
Typ.
20
21
35
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Area (μm)
Chip Thickness (μm)
Top Au Bond Pad (μm) - Qty. 2
Au Bond Pad Thickness (μm)
Back Contact Metal Area (μm)
Back Contact Metal Thickness (μm)
CxxxEZ1000-Sxx000-2
Dimensions
Tolerance
950 x 950
± 35
980 x 980
± 35
170
± 25
150 x 150
± 25
3.0
± 1.5
980 x 980
± 35
3.0
± 1.5
Notes:
1. Maximum ratings are package-dependent. The above ratings were determined using a 3.45 x 3.45 mm SMT package without an
encapsulant for characterization. Ratings for other packages may differ. The junction temperature should be characterized in a
specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).See Cree
EZBright Applications Note for assembly-process information.
2. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 350 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by the manufacturer in large quantities and are provided for information only. All
measurements were made using a Au-plated TO39 header without an encapsulant. Optical characteristics were measured in an
integrating sphere using Illuminance E.
3. The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for
the end-product to be designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to
optimize product performance.
1200
1000
800
600
Rth _j-a = 10 °C/W
400
Rth _j-a = 15 °C/W
Rth _j-a = 20 °C/W
Rth _j-a = 25 °C/W
200
0
25
50
75
100
125
150
175
Ambient Temperature (˚C)
Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and EZBright. EZ1000 and EZ are trademarks of Cree, Inc.
2
CPR3EC Rev. A
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com